Yazar
Prasad, B. K. Raghu, author.
Yer Numarası
TA658.44 .P73 2020 EB
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9781351250528
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
Linderholt, Andreas, editor. Allen, Matthew S., editor. Mayes, R. (Randy), editor. Rixen, Daniel, editor. International Modal Analysis Conference (37th : 2019 : Orlando, Fla.)
Yer Numarası
TA654
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9788743803539
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
International Modal Analysis Conference (37th : 2019) Dervilis, Nikolaos, editor.
Yer Numarası
TA654 .I58 2019 EB
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9788743803546
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
Feng, Dongming. Feng, Maria Q.
Yer Numarası
TA654
Elektronik Erişim
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
Bovensiepen, Uwe. Petek, Hrvoje. Wolf, Martin.
Yer Numarası
ONLINE
Elektronik Erişim
Wiley http://dx.doi.org/10.1002/9783527646463
Wiley InterScience http://dx.doi.org/10.1002/9783527646463
Wiley InterScience http://dx.doi.org/10.1002/9783527646463
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
International Modal Analysis Conference (38th : 2020 : Houston, Tex.) Mao, Zhu (Professor of mechanical engineering), editor.
Yer Numarası
TA654 .I58 2020 EB
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9788743803669
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
International Modal Analysis Conference (37th : 2019) Barthorpe, Robert, editor.
Yer Numarası
TA654 .I58 2019 EB
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9788743803522
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
Bi, Zhuming, author. Wang, Xiaoqin (Writer on manufacturing), author.
Yer Numarası
TS155.6
Elektronik Erişim
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
Alavi, Saman.
Yer Numarası
QC28
Elektronik Erişim
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
Chakraverty, Snehashish, editor.
Yer Numarası
Q175.32 .M38 M38 2020
Elektronik Erişim
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
International Modal Analysis Conference (37th : 2019) Kerschen, G., editor.
Yer Numarası
TA352 .I58 2019 EB
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9788743803508
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
International Modal Analysis Conference (37th : 2019) Walber, Chad, editor.
Yer Numarası
TK7872 .D48 I58 2019 EB
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9788743803560
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
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