Başlık:
Interconnect Reliability in Advanced Memory Device Packaging
Yazar:
Gan, Chong Leong,. author.
ISBN:
9783031267086
Basım Bilgisi:
1st ed. 2023.
Fiziksel Tanımlama:
XVIII, 210 p. 100 illus., 89 illus. in color. online resource.
Seri:
Springer Series in Reliability Engineering,
İçerik:
Chapter 1: Advanced Memory and Device Packaging -- Chapter 2: Wearout Reliability-based Characterization in Memory Packaging -- Chapter 3: Recycling of Noble Metals Used in Memory Packaging -- Chapter 4: Advanced Flip Chip Packaging -- Chapter 5: Second Level Interconnect Reliability of Low Temperature Solder Materials Used in Memory Modules and Solid-State Drives (SSD) -- Chapter 6: Specific Packaging Reliability Testing -- Chapter 7: Reliability Simulation and Modeling in Memory Packaging -- Chapter 8: Interconnects Reliability for Future Cryogenic Memory Applications.
Yazar Ek Girişi:
Tüzel Kişi Ek Girişi:
Elektronik Erişim:
https://doi.org/10.1007/978-3-031-26708-6Kopya:
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Kütüphane | Materyal Türü | Demirbaş Numarası | Yer Numarası | Durumu/İade Tarihi | Materyal Ayırtma |
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Arıyor... | E-Kitap | 526838-1001 | ONLINE | Arıyor... | Arıyor... |