Arama Sonuçlarını Sınırlandır
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SpringerLink (Online service)
(50)
Yang, Qingxin. editor.
(23)
Bie, Zhaohong. editor. (orcid)0000-0003-0579-1860
(8)
Yang, Xu. editor.
(8)
Li, Jian. editor.
(7)
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Electronics and Microelectronics, Instrumentation.
(49)
Electronic Circuits and Systems.
(35)
Electronic circuits.
(35)
Electric power production.
(23)
Electrical Power Engineering.
(23)
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67 sonuç bulundu Arama sonuçlarına abone ol
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1. 
Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment Proceedings of the NATO Advanced Research Workshop on Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment Kiev, Ukraine 26–30 April 2004 için kapak resmi
Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment Proceedings of the NATO Advanced Research Workshop on Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment Kiev, Ukraine 26–30 April 2004
Yazar 
Flandre, Denis. editor. Nazarov, Alexei N. editor. Hemment, Peter L.F. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
http://dx.doi.org/10.1007/1-4020-3013-4
Format: 
Durum 
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2. 
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume II için kapak resmi
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume II
Yazar 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-97-8812-5
Format: 
Durum 
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3. 
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume I için kapak resmi
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume I
Yazar 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-97-8780-7
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Durum 
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4. 
The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume VIII için kapak resmi
The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume VIII
Yazar 
Yang, Qingxin. editor. Bie, Zhaohong. editor. (orcid)0000-0003-0579-1860 Yang, Xu. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-96-4787-3
Format: 
Durum 
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5. 
Advances in Micro-Electronics, Embedded Systems and IoT Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 1 için kapak resmi
Advances in Micro-Electronics, Embedded Systems and IoT Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 1
Yazar 
Bhateja, Vikrant. editor. Anguera, Jaume. editor. Ghosh, Anumoy. editor. (orcid)0000-0003-4865-5893 Chowdary, P. Satish Rama. editor. (orcid)0000-0002-1649-4258 SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-96-7222-6
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6. 
Alternating Current Field Measurement Technique for Detection and Measurement of Cracks in Structures için kapak resmi
Alternating Current Field Measurement Technique for Detection and Measurement of Cracks in Structures
Yazar 
Li, Wei. author. Yuan, Xin'an. author. Zhao, Jianming. author. Yin, Xiaokang. author. Li, Xiao. author.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-97-7255-1
Format: 
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7. 
Advanced Techniques for Assertion-Based Verification in Hardware Designs Using Data Mining Algorithms için kapak resmi
Advanced Techniques for Assertion-Based Verification in Hardware Designs Using Data Mining Algorithms
Yazar 
Heidari Iman, Mohammad Reza. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-90410-3
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Durum 
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8. 
Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 3 için kapak resmi
Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 3
Yazar 
Bhateja, Vikrant. editor. Omar, Zaid. editor. Ghosh, Anumoy. editor. (orcid)0000-0003-4865-5893 Shrivastava, Sarika. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-96-7249-3
Format: 
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9. 
Artificial Plasmonics for VLSI Interconnects : Bridging the Gap Between Electronics and Optics. için kapak resmi
Artificial Plasmonics for VLSI Interconnects : Bridging the Gap Between Electronics and Optics.
Yazar 
Joy, Soumitra R.
Yer Numarası 
TK7874
Elektronik Erişim 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394290000
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10. 
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume III için kapak resmi
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume III
Yazar 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-97-8816-3
Format: 
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11. 
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume VII için kapak resmi
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume VII
Yazar 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-97-8832-3
Format: 
Durum 
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12. 
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume V için kapak resmi
The Proceedings of the 11th Frontier Academic Forum of Electrical Engineering (FAFEE2024) Volume V
Yazar 
Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-97-8824-8
Format: 
Durum 
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