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107 sonuç bulundu Arama sonuçlarına abone ol
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1. 
Regional integration and the global trading system için kapak resmi
Regional integration and the global trading system
Yazar 
Anderson, Kym, ed. Blackhurst, Richard, ed.
Yer Numarası 
HF 1418.5 R44 1993
Format: 
Durum 
Beytepe Kütüphanesi~1
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2. 
Sensory-motor integration in the nervous system için kapak resmi
Sensory-motor integration in the nervous system
Yazar 
Creutzfeldt, O., ed. Schmidt, R. F., ed. Willis, W. D., ed.
Yer Numarası 
WL 102 S474 1984 1.K
Format: 
Durum 
Sağlık Bilimleri Kütüphanesi~1
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3. 
Gas Turbine Design, Components and System Design Integration için kapak resmi
Gas Turbine Design, Components and System Design Integration
Yazar 
Schobeiri, Meinhard T. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-58378-5
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Durum 
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4. 
Multisensor Fusion and Integration in the Wake of Big Data, Deep Learning and Cyber Physical System An Edition of the Selected Papers from the 2017 IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems (MFI 2017) için kapak resmi
Multisensor Fusion and Integration in the Wake of Big Data, Deep Learning and Cyber Physical System An Edition of the Selected Papers from the 2017 IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems (MFI 2017)
Yazar 
Lee, Sukhan. editor. Ko, Hanseok. editor. Oh, Songhwai. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-90509-9
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5. 
Network-on-chip : the next generation of system-on-chip integration için kapak resmi
Network-on-chip : the next generation of system-on-chip integration
Yazar 
Kundu, Santanu, author. Chattopadhyay, Santanu, contributor.
Yer Numarası 
ONLINE(357050.1)
Elektronik Erişim 
Distributed by publisher. Purchase or institutional license may be required for access.
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6. 
Wind Power Integration Connection and System Operational Aspects için kapak resmi
Wind Power Integration Connection and System Operational Aspects
Yazar 
Fox, Brendan Bryans, Leslie Flynn, Damian Jenkins, Nick Milborrow, David
Yer Numarası 
\(364920.1)
Elektronik Erişim 
http://dx.doi.org/10.1049/PBRN014E
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7. 
System design and control integration for advanced manufacturing için kapak resmi
System design and control integration for advanced manufacturing
Yazar 
Li, Han-Xiong, author. Lu, XinJiang (Manufacturing researcher), author.
Yer Numarası 
ONLINE(341830.1)
Elektronik Erişim 
Ebook Library http://public.eblib.com/choice/PublicFullRecord.aspx?p=1818247
John Wiley http://dx.doi.org/10.1002/9781118822401
http://swb.eblib.com/patron/FullRecord.aspx?p=1818247
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8. 
Driving sustainability to business success : the DS factor-management system integration and automation için kapak resmi
Driving sustainability to business success : the DS factor-management system integration and automation
Yazar 
Pilot, Jayne.
Yer Numarası 
ONLINE(342062.1)
Elektronik Erişim 
Ebook Library Click here to view book
Cover image http://catalogimages.wiley.com/images/db/jimages/9781118356937.jpg
John Wiley http://dx.doi.org/10.1002/9781118936733
Image http://images.contentreserve.com/ImageType-100/0128-1/{97DD79E9-A497-4924-970A-A4EBEA6F6FBE}Img100.jpg
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9. 
VLSI-SoC: From Algorithms to Circuits and System-on-Chip Design 20th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2012, Santa Cruz, CA, USA, October 7-10, 2012, Revised Selected Papers için kapak resmi
VLSI-SoC: From Algorithms to Circuits and System-on-Chip Design 20th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2012, Santa Cruz, CA, USA, October 7-10, 2012, Revised Selected Papers
Yazar 
Burg, Andreas. editor. Coṣkun, Ayṣe. editor. Guthaus, Matthew. editor. Katkoori, Srinivas. editor. Reis, Ricardo. editor.
Yer Numarası 
ONLINE(335188.1)
Elektronik Erişim 
http://dx.doi.org/10.1007/978-3-642-45073-0
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10. 
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC için kapak resmi
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Yazar 
Li, Er-Ping.
Yer Numarası 
TK7874.893 L53 2012
Format: 
Durum 
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11. 
Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC için kapak resmi
Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Yazar 
Li, Er-Ping. Wiley InterScience (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
IEEEXplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551
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12. 
Integration of distributed generation in the power system için kapak resmi
Integration of distributed generation in the power system
Yazar 
Bollen, Math H. J., 1960-
Yer Numarası 
ONLINE
Elektronik Erişim 
IEEE Xplore http://ieeexplore.ieee.org/servlet/opac?bknumber=6047601
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