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Yazar

SpringerLink (Online service)

(5)

Brown, William D., 1943-

(2)

Greenhouse, Hal.

(2)

Ulrich, Richard K. (Richard Kevin), 1955-

(2)

Barlow, Fred D.

(1)

Blackwell, Glenn R.

(1)

Cressler, John D.

(1)

Del Castillo, Enrique.

(1)

Elshabini, Aicha.

(1)

Gerlach, Gerald. editor.

(1)

(1)

Hurwitz, Arnon Max.

(1)

Jamnia, Ali, 1961-

(1)

Lee, Ning-Cheng.

(1)

Lee, Y. C. editor.

(1)

Li, Yi (Grace). editor.

(1)

Licari, James J., 1930-

(1)

Liu, S. (Sheng), 1963-

(1)

Liu, Yong. author.

(1)

Lowry, Robert (Robert K.), 1944-

(1)

Luo, Xiaobing, 1974-

(1)

Mantooth, H. Alan, 1963-

(1)

Moon, Kyoung-Sik. editor.

(1)

(1)

Pengelly, Raymond S.

(1)

Puttlitz, Karl J.

(1)

Remsburg, Ralph.

(1)

Romenesko, Bruce.

(1)

Stalter, Kathleen A.

(1)

Suganuma, Katsuaki.

(1)

Suhir, E. editor.

(1)

Swanson, Dale W.

(1)

Süli, Frank, author.

(1)

Tai-Ran Hsu, ed.

(1)

Tong, Xingcun Colin. author.

(1)

Wolter, Klaus-Jürgen. editor.

(1)

Wong, C. P. editor.

(1)

Wong, C.P. editor.

(1)

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Electronic packaging.

(14)

(4)

Electronic books.

(3)

(3)

Microelectronic packaging.

(3)

Optical materials.

(3)

Solder and soldering.

(3)

Chip scale packaging.

(2)

Electronic apparatus and appliances -- Design and construction.

(2)

Electronics -- Materials -- Permeability.

(2)

Nanotechnology.

(2)

Sealing (Technology)

(2)

Surfaces (Physics).

(2)

(1)

Aerospace engineering.

(1)

Amplifiers (Electronics).

(1)

Biomedical engineering.

(1)

(1)

(1)

(1)

Dichtung (Technik)

(1)

Electric connectors.

(1)

Electric lighting -- Equipment and supplies.

(1)

Electronic apparatus and appliances -- Reliability.

(1)

Electronic apparatus and appliances -- Thermal properties.

(1)

Electronic ceramics.

(1)

Electronic packaging -- Handbooks, manuals, etc.

(1)

Electronic packaging -- Materials.

(1)

Electronics -- Materials.

(1)

Elektronisches Bauelement.

(1)

Engineering design.

(1)

Environmental protection.

(1)

Environmental testing.

(1)

Extreme environments.

(1)

Field-effect transistors.

(1)

Gallium arsenide.

(1)

Green products.

(1)

Heat -- Transmission.

(1)

Interconnects (Integrated circuit technology) -- Design and construction.

(1)

Light emitting diodes -- Computer simulation.

(1)

Light emitting diodes -- Design and construction.

(1)

Microelectromechanical systems.

(1)

Microelectronics.

(1)

Microfabrication.

(1)

Micromechanics.

(1)

Microwave transistors.

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Mise sous boîtier (Microélectronique)

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Mise sous boîtier (Électronique)

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Mixing circuits.

(1)

Nanostructured materials.

(1)

Optoelectronic devices.

(1)

Oscillators, Electric.

(1)

Particles (Nuclear physics).

(1)

Passive components.

(1)

(1)

Production management.

(1)

Production of electric energy or power.

(1)

Sealing (Technology).

(1)

Semiconductor industry -- Production control.

(1)

Semiconductors -- Design and construction.

(1)

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(1)

(1)

Systems engineering.

(1)

Telecommunication.

(1)

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13.

MEMS/MOEMS packaging concepts, designs, materials, and processes için kapak resmi

MEMS/MOEMS packaging concepts, designs, materials, and processes

MEMS/MOEMS packaging concepts, designs, materials, and processes

Yazar

Gilleo, Ken.

Yer Numarası

ONLINE

Elektronik Erişim

Subscription required

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14.

Practical guide to the packaging of electronics thermal and mechanical design and analysis için kapak resmi

Practical guide to the packaging of electronics thermal and mechanical design and analysis

Practical guide to the packaging of electronics thermal and mechanical design and analysis

Yazar

Jamnia, Ali, 1961-

Yer Numarası

ONLINE

Elektronik Erişim

Distributed by publisher. Purchase or institutional license may be required for access.

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15.

Ceramic interconnect technology handbook için kapak resmi

Ceramic interconnect technology handbook

Ceramic interconnect technology handbook

Yazar

Barlow, Fred D. Elshabini, Aicha.

Yer Numarası

ONLINE

Elektronik Erişim

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16.

Adhesives technology for electronic applications materials, processes, reliability için kapak resmi

Adhesives technology for electronic applications materials, processes, reliability

Adhesives technology for electronic applications materials, processes, reliability

Yazar

Licari, James J., 1930- Swanson, Dale W.

Yer Numarası

ONLINE

Elektronik Erişim

ScienceDirect http://www.sciencedirect.com/science/book/9780815515135

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17.

Lead-free soldering in electronics science, technology and environmental impact için kapak resmi

Lead-free soldering in electronics science, technology and environmental impact

Lead-free soldering in electronics science, technology and environmental impact

Yazar

Suganuma, Katsuaki.

Yer Numarası

ONLINE

Elektronik Erişim

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18.

Handbook of lead-free solder technology for microelectronic assemblies için kapak resmi

Handbook of lead-free solder technology for microelectronic assemblies

Handbook of lead-free solder technology for microelectronic assemblies

Yazar

Puttlitz, Karl J. Stalter, Kathleen A.

Yer Numarası

ONLINE

Elektronik Erişim

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19.

MEMS Packaging için kapak resmi

Yazar

Tai-Ran Hsu, ed.

Yer Numarası

ONLINE

Elektronik Erişim

http://dx.doi.org/10.1049/PBEP003E

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20.

Reflow soldering processes SMT, BGA, CSP and flip chip technologies için kapak resmi

Reflow soldering processes SMT, BGA, CSP and flip chip technologies

Reflow soldering processes SMT, BGA, CSP and flip chip technologies

Yazar

Lee, Ning-Cheng.

Yer Numarası

ONLINE

Elektronik Erişim

Volltext http://www.sciencedirect.com/science/book/9780750672184

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21.

Thermal design of electronic equipment için kapak resmi

Thermal design of electronic equipment

Thermal design of electronic equipment

Yazar

Remsburg, Ralph.

Yer Numarası

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Elektronik Erişim

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22.

Run-to-run control in semiconductor manufacturing için kapak resmi

Run-to-run control in semiconductor manufacturing

Run-to-run control in semiconductor manufacturing

Yazar

Moyne, James. Del Castillo, Enrique. Hurwitz, Arnon Max.

Yer Numarası

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Elektronik Erişim

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23.

Hermeticity of electronic packages için kapak resmi

Hermeticity of electronic packages

Hermeticity of electronic packages

Yazar

Greenhouse, Hal.

Yer Numarası

ONLINE

Elektronik Erişim

ScienceDirect http://www.sciencedirect.com/science/book/9780815514350

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24.

Microwave Field-Effect Transistors Theory, design and applications için kapak resmi

Microwave Field-Effect Transistors Theory, design and applications

Microwave Field-Effect Transistors Theory, design and applications

Yazar

Pengelly, Raymond S.

Yer Numarası

ONLINE

Elektronik Erişim

http://dx.doi.org/10.1049/SBEW016E

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