Search Results for Electronic packaging.

|

Kütüphane Hesabım

|

|

|

Remember to clear the cache and close the browser window.

Search Limit

Rooms Restriction Values

8

Search Field

Target Value

Limit Value

Restriction Value

Arama:

Gelişmiş Arama

Arama Sonuçlarını Sınırlandır

Daraltılmış:

+

Shelf Location: Elektronik Kütüphane

Yazar

SpringerLink (Online service)

(5)

Brown, William D., 1943-

(2)

Greenhouse, Hal.

(2)

Ulrich, Richard K. (Richard Kevin), 1955-

(2)

Barlow, Fred D.

(1)

Blackwell, Glenn R.

(1)

Cressler, John D.

(1)

Del Castillo, Enrique.

(1)

Elshabini, Aicha.

(1)

Gerlach, Gerald. editor.

(1)

(1)

Hurwitz, Arnon Max.

(1)

Jamnia, Ali, 1961-

(1)

Lee, Ning-Cheng.

(1)

Lee, Y. C. editor.

(1)

Li, Yi (Grace). editor.

(1)

Licari, James J., 1930-

(1)

Liu, S. (Sheng), 1963-

(1)

Liu, Yong. author.

(1)

Lowry, Robert (Robert K.), 1944-

(1)

Luo, Xiaobing, 1974-

(1)

Mantooth, H. Alan, 1963-

(1)

Moon, Kyoung-Sik. editor.

(1)

(1)

Pengelly, Raymond S.

(1)

Puttlitz, Karl J.

(1)

Remsburg, Ralph.

(1)

Romenesko, Bruce.

(1)

Stalter, Kathleen A.

(1)

Suganuma, Katsuaki.

(1)

Suhir, E. editor.

(1)

Swanson, Dale W.

(1)

Süli, Frank, author.

(1)

Tai-Ran Hsu, ed.

(1)

Tong, Xingcun Colin. author.

(1)

Wolter, Klaus-Jürgen. editor.

(1)

Wong, C. P. editor.

(1)

Wong, C.P. editor.

(1)

Tümünü genişlet

Dil

(22)

Yayın Yılı

-

(3)

(3)

(3)

(2)

(2)

(2)

(2)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

Tümünü genişlet

Konu

Electronic packaging.

(14)

(4)

Electronic books.

(3)

(3)

Microelectronic packaging.

(3)

Optical materials.

(3)

Solder and soldering.

(3)

Chip scale packaging.

(2)

Electronic apparatus and appliances -- Design and construction.

(2)

Electronics -- Materials -- Permeability.

(2)

Nanotechnology.

(2)

Sealing (Technology)

(2)

Surfaces (Physics).

(2)

(1)

Aerospace engineering.

(1)

Amplifiers (Electronics).

(1)

Biomedical engineering.

(1)

(1)

(1)

(1)

Dichtung (Technik)

(1)

Electric connectors.

(1)

Electric lighting -- Equipment and supplies.

(1)

Electronic apparatus and appliances -- Reliability.

(1)

Electronic apparatus and appliances -- Thermal properties.

(1)

Electronic ceramics.

(1)

Electronic packaging -- Handbooks, manuals, etc.

(1)

Electronic packaging -- Materials.

(1)

Electronics -- Materials.

(1)

Elektronisches Bauelement.

(1)

Engineering design.

(1)

Environmental protection.

(1)

Environmental testing.

(1)

Extreme environments.

(1)

Field-effect transistors.

(1)

Gallium arsenide.

(1)

Green products.

(1)

Heat -- Transmission.

(1)

Interconnects (Integrated circuit technology) -- Design and construction.

(1)

Light emitting diodes -- Computer simulation.

(1)

Light emitting diodes -- Design and construction.

(1)

Microelectromechanical systems.

(1)

Microelectronics.

(1)

Microfabrication.

(1)

Micromechanics.

(1)

Microwave transistors.

(1)

Mise sous boîtier (Microélectronique)

(1)

Mise sous boîtier (Électronique)

(1)

Mixing circuits.

(1)

Nanostructured materials.

(1)

Optoelectronic devices.

(1)

Oscillators, Electric.

(1)

Particles (Nuclear physics).

(1)

Passive components.

(1)

(1)

Production management.

(1)

Production of electric energy or power.

(1)

Sealing (Technology).

(1)

Semiconductor industry -- Production control.

(1)

Semiconductors -- Design and construction.

(1)

Semiconductors.

(1)

(1)

Systems engineering.

(1)

Telecommunication.

(1)

Tümünü genişlet

Materyal Türü

Kütüphane

Çevrimiçi Kütüphane

{sortLabel}

	{facetName}	{results}

	{displayName}	{count}
{error}

Liste görünümüne geç

Küçük resim görünümüne geç

Eylem Seç

Ayırt
Listelerime ekle
Eposta
Yazdır

24 sonuç bulundu

Arama sonuçlarına abone ol

1 2

000000000000DEFAULT_TR

Yazdır

Liste seç

Bunu varsayılan liste yap.

Öğeler başarıyla eklendi

Öğeler eklenirken hata oldu. Lütfen tekrar deneyiniz.

One or more items could not be added because you are not logged in.

13.

MEMS/MOEMS packaging concepts, designs, materials, and processes için kapak resmi

MEMS/MOEMS packaging concepts, designs, materials, and processes

MEMS/MOEMS packaging concepts, designs, materials, and processes

Yazar

Gilleo, Ken.

Yer Numarası

ONLINE

Elektronik Erişim

Subscription required

Format:

Durum

Çevrimiçi Kütüphane~1

Rafta:
Kopya:

14.

Practical guide to the packaging of electronics thermal and mechanical design and analysis için kapak resmi

Practical guide to the packaging of electronics thermal and mechanical design and analysis

Practical guide to the packaging of electronics thermal and mechanical design and analysis

Yazar

Jamnia, Ali, 1961-

Yer Numarası

ONLINE

Elektronik Erişim

Distributed by publisher. Purchase or institutional license may be required for access.

Format:

Durum

Çevrimiçi Kütüphane~1

Rafta:
Kopya:

15.

Ceramic interconnect technology handbook için kapak resmi

Ceramic interconnect technology handbook

Ceramic interconnect technology handbook

Yazar

Barlow, Fred D. Elshabini, Aicha.

Yer Numarası

ONLINE

Elektronik Erişim

Distributed by publisher. Purchase or institutional license may be required for access.

Format:

Durum

Çevrimiçi Kütüphane~1

Rafta:
Kopya:

16.

Adhesives technology for electronic applications materials, processes, reliability için kapak resmi

Adhesives technology for electronic applications materials, processes, reliability

Adhesives technology for electronic applications materials, processes, reliability

Yazar

Licari, James J., 1930- Swanson, Dale W.

Yer Numarası

ONLINE

Elektronik Erişim

ScienceDirect http://www.sciencedirect.com/science/book/9780815515135

Format:

Durum

Çevrimiçi Kütüphane~1

Rafta:
Kopya:

17.

MEMS Packaging için kapak resmi

Yazar

Tai-Ran Hsu, ed.

Yer Numarası

ONLINE

Elektronik Erişim

http://dx.doi.org/10.1049/PBEP003E

Format:

Durum

Çevrimiçi Kütüphane~1

Rafta:
Kopya:

18.

Lead-free soldering in electronics science, technology and environmental impact için kapak resmi

Lead-free soldering in electronics science, technology and environmental impact

Lead-free soldering in electronics science, technology and environmental impact

Yazar

Suganuma, Katsuaki.

Yer Numarası

ONLINE

Elektronik Erişim

Distributed by publisher. Purchase or institutional license may be required for access.

Format:

Durum

Çevrimiçi Kütüphane~1

Rafta:
Kopya:

19.

Handbook of lead-free solder technology for microelectronic assemblies için kapak resmi

Handbook of lead-free solder technology for microelectronic assemblies

Handbook of lead-free solder technology for microelectronic assemblies

Yazar

Puttlitz, Karl J. Stalter, Kathleen A.

Yer Numarası

ONLINE

Elektronik Erişim

Distributed by publisher. Purchase or institutional license may be required for access.

Format:

Durum

Çevrimiçi Kütüphane~1

Rafta:
Kopya:

20.

Reflow soldering processes SMT, BGA, CSP and flip chip technologies için kapak resmi

Reflow soldering processes SMT, BGA, CSP and flip chip technologies

Reflow soldering processes SMT, BGA, CSP and flip chip technologies

Yazar

Lee, Ning-Cheng.

Yer Numarası

ONLINE

Elektronik Erişim

Volltext http://www.sciencedirect.com/science/book/9780750672184

Format:

Durum

Çevrimiçi Kütüphane~1

Rafta:
Kopya:

21.

Run-to-run control in semiconductor manufacturing için kapak resmi

Run-to-run control in semiconductor manufacturing

Run-to-run control in semiconductor manufacturing

Yazar

Moyne, James. Del Castillo, Enrique. Hurwitz, Arnon Max.

Yer Numarası

ONLINE

Elektronik Erişim

Distributed by publisher. Purchase or institutional license may be required for access.

Format:

Durum

Çevrimiçi Kütüphane~1

Rafta:
Kopya:

22.

Thermal design of electronic equipment için kapak resmi

Thermal design of electronic equipment

Thermal design of electronic equipment

Yazar

Remsburg, Ralph.

Yer Numarası

ONLINE

Elektronik Erişim

Distributed by publisher. Purchase or institutional license may be required for access.

Format:

Durum

Çevrimiçi Kütüphane~1

Rafta:
Kopya:

23.

Hermeticity of electronic packages için kapak resmi

Hermeticity of electronic packages

Hermeticity of electronic packages

Yazar

Greenhouse, Hal.

Yer Numarası

ONLINE

Elektronik Erişim

ScienceDirect http://www.sciencedirect.com/science/book/9780815514350

Format:

Durum

Çevrimiçi Kütüphane~1

Rafta:
Kopya:

24.

Microwave Field-Effect Transistors Theory, design and applications için kapak resmi

Microwave Field-Effect Transistors Theory, design and applications

Microwave Field-Effect Transistors Theory, design and applications

Yazar

Pengelly, Raymond S.

Yer Numarası

ONLINE

Elektronik Erişim

http://dx.doi.org/10.1049/SBEW016E

Format:

Durum

Çevrimiçi Kütüphane~1

Rafta:
Kopya:

Eylem Seç

Ayırt
Listelerime ekle
Eposta
Yazdır

1 2

Copyright 2011 Sirsi Corporation - Enterprise Version 5.0.0.11