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Language: English

Yazar

Keser, Beth, 1971- editor.

(2)

Mittal, K. L., 1945- editor.

(2)

SpringerLink (Online service)

(2)

Ahsan, Tanweer, editor.

(1)

(1)

Brand, Oliver. author.

(1)

Chen, Andrea., author.

(1)

Chen, Jing, 1974-

(1)

Choudhary, Vikas.

(1)

(1)

(1)

Iniewski, Krzysztof.

(1)

Jim�enez, J. (Juan)

(1)

Jin, Yufeng., author.

(1)

John Wiley & Sons.

(1)

Kroehnert, Steffen, 1970- editor.

(1)

Kröhnert, Steffen, editor.

(1)

(1)

Liu, Duixian, editor.

(1)

Liu, S. (Sheng), 1963-

(1)

(1)

Liu, Yong, 1962-

(1)

(1)

Mayer, Michael. author.

(1)

Mittal, Kash L., 1945- editor.

(1)

Osaka, Tetsuya, 1945-

(1)

Pecht, Michael.

(1)

Ramaswami, Sesh.

(1)

Schultze, J. W. (Joachim Walter)

(1)

Schwizer, Jürg. author.

(1)

Suganuma, Katsuaki, editor.

(1)

Taylor and Francis.

(1)

(1)

Voyiadjis, George Z. editor.

(1)

Wang, Zhiping, 1962- Oct. 6-

(1)

Wiley InterScience (Online service)

(1)

(1)

Zhang, Yueping, editor.

(1)

Tümünü genişlet

Yayın Yılı

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Tümünü genişlet

Konu

Microelectronic packaging.

(11)

Electronic books.

(3)

Nanotechnology.

(3)

(2)

Chip scale packaging.

(2)

(2)

Microelectromechanical systems.

(2)

Microelectronic packaging

(2)

Mise sous boîtier (Microélectronique)

(2)

TECHNOLOGY & ENGINEERING.

(2)

Adhesion -- Congresses.

(1)

(1)

Adhesive joints.

(1)

(1)

(1)

Antennes microrubans.

(1)

Boîtiers à puce.

(1)

Building materials.

(1)

Ceramic materials.

(1)

(1)

(1)

Chip scale packaging

(1)

Circuits intégrés -- Intégration sur la plaquette.

(1)

(1)

Classical Mechanics.

(1)

Coatings -- Congresses.

(1)

(1)

Electric connectors.

(1)

Electronic apparatus and appliances -- Design and construction.

(1)

Electronic packaging.

(1)

Engineering Mechanics.

(1)

High power lasers.

(1)

Integrated circuits -- Wafer-scale integration

(1)

Integrated circuits -- Wafer-scale integration.

(1)

Integrated circuits industry.

(1)

Mechanics, Applied.

(1)

(1)

Microelectronic packaging -- Materials.

(1)

Microelectronic packaging -- Simulation methods.

(1)

Microstrip antennas

(1)

Microstrip antennas.

(1)

Mobile & Wireless Communications.

(1)

Multichip modules (Microelectronics)

(1)

Nanoelectronics.

(1)

(1)

Nanostructured materials.

(1)

Optical materials.

(1)

Optoelectronic devices.

(1)

Passive components.

(1)

Photoluminescence.

(1)

Printed circuits -- Equipment and supplies.

(1)

(1)

Semiconductor lasers.

(1)

Semiconductors -- Design and construction.

(1)

Solid Mechanics.

(1)

(1)

Strains and stresses -- Measurement.

(1)

Structural Materials.

(1)

(1)

TECHNOLOGY & ENGINEERING -- Mechanical.

(1)

TECHNOLOGY & ENGINEERING -- Mobile & Wireless Communications.

(1)

Telecommunication -- Equipment and supplies.

(1)

Telecommunication -- Technological innovations.

(1)

Thin films -- Congresses.

(1)

(1)

Three-dimensional integrated circuits -- Computer-aided design.

(1)

Three-dimensional integrated circuits -- Design and construction.

(1)

Three-dimensional integrated circuits -- Testing.

(1)

Three-dimensional integrated circuits.

(1)

Wide gap semiconductors.

(1)

(1)

Tümünü genişlet

Materyal Türü

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1.

Semiconductor packaging : materials interaction and reliability için kapak resmi

Semiconductor packaging : materials interaction and reliability

Semiconductor packaging : materials interaction and reliability

Yazar

Chen, Andrea., author. Lo, Randy.

Yer Numarası

TK7870.15 .C54 2012

Elektronik Erişim

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2.

Quantum-well laser array packaging nanoscale packaging techniques için kapak resmi

Quantum-well laser array packaging nanoscale packaging techniques

Quantum-well laser array packaging nanoscale packaging techniques

Yazar

Tomm, Jens W. Jim�enez, J. (Juan)

Yer Numarası

ONLINE

Elektronik Erişim

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3.

MEMS/MOEMS packaging concepts, designs, materials, and processes için kapak resmi

MEMS/MOEMS packaging concepts, designs, materials, and processes

MEMS/MOEMS packaging concepts, designs, materials, and processes

Yazar

Gilleo, Ken.

Yer Numarası

ONLINE

Elektronik Erişim

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4.

3D IC stacking technology için kapak resmi

3D IC stacking technology

3D IC stacking technology

Yazar

Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.

Yer Numarası

ONLINE

Elektronik Erişim

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5.

Introduction to microsystem packaging technology için kapak resmi

Introduction to microsystem packaging technology

Introduction to microsystem packaging technology

Yazar

Jin, Yufeng., author. Wang, Zhiping, 1962- Oct. 6- Chen, Jing, 1974-

Yer Numarası

TK7870.15 .J56 2011

Elektronik Erişim

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6.

Nanotechnology for telecommunications için kapak resmi

Nanotechnology for telecommunications

Nanotechnology for telecommunications

Yazar

Anwar, Sohail.

Yer Numarası

TK5103 .N36 2010

Elektronik Erişim

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7.

IC component sockets için kapak resmi

IC component sockets

IC component sockets

Yazar

Liu, Weifeng. Pecht, Michael. John Wiley & Sons.

Yer Numarası

ONLINE

Elektronik Erişim

John Wiley http://dx.doi.org/10.1002/0471648272
Contributor biographical information http://catdir.loc.gov/catdir/bios/wiley046/2004043361.html

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