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Brown, William D., 1943-

(2)

Greenhouse, Hal.

(2)

Ulrich, Richard K. (Richard Kevin), 1955-

(2)

Agarwal, Rakish, author.

(1)

Avtgis, Alexander W.

(1)

Barlow, Fred D.

(1)

Blackwell, Glenn R.

(1)

Carney, Charles (Charles F.)

(1)

Cepeda-Rizo, Juan, author.

(1)

(1)

Cressler, John D.

(1)

Del Castillo, Enrique.

(1)

Dishongh, Terrance J., author.

(1)

Dorf, Richard C.

(1)

Elshabini, Aicha.

(1)

Gayle, Jeremiah, author.

(1)

Gerlach, Gerald. editor.

(1)

(1)

Hurwitz, Arnon Max.

(1)

(1)

Jamnia, Ali, 1961- author.

(1)

Javadpour, Sirus, author.

(1)

Lee, Ning-Cheng.

(1)

(1)

Lee, Y. C. editor.

(1)

Li, Yi (Grace). editor.

(1)

Licari, James J., 1930-

(1)

Liu, S. (Sheng), 1963-

(1)

Liu, Yong. author.

(1)

Lowry, Robert (Robert K.), 1944-

(1)

Luo, Xiaobing, 1974-

(1)

Madhava Rao, K., editor.

(1)

Mahajan, Rahul, author.

(1)

Mantooth, H. Alan, 1963-

(1)

McCluskey, F. Patrick, author.

(1)

Megow, William F.

(1)

Monkhouse, Donald C.

(1)

Moon, Kyoung-Sik. editor.

(1)

(1)

Osten, Wolfgang.

(1)

Pecht, Michael, author.

(1)

Pecht, Michael.

(1)

Pengelly, Raymond S.

(1)

Puttlitz, Karl J.

(1)

Ravich, Joshua, author.

(1)

Remsburg, Ralph., author.

(1)

Romenesko, Bruce.

(1)

Stalter, Kathleen A.

(1)

Suganuma, Katsuaki.

(1)

Suhir, E. editor.

(1)

Suhir, Ephraim.

(1)

Swanson, Dale W.

(1)

Süli, Frank, author.

(1)

Tai-Ran Hsu, ed.

(1)

Tong, Xingcun Colin. author.

(1)

Vasudeva Reddy, T., editor.

(1)

Villanucci, Robert S., 1944-

(1)

Voyiadjis, George Z. editor.

(1)

Walker, C. A. (Colin A.)

(1)

Whitaker, Jerry C.

(1)

Wolter, Klaus-Jürgen. editor.

(1)

(1)

Wong, C. P. editor.

(1)

Wong, C.P. editor.

(1)

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Electronic packaging.

(18)

(4)

Electronic apparatus and appliances -- Design and construction.

(3)

Electronic books.

(3)

(3)

Microelectronic packaging.

(3)

Microelectronics.

(3)

Nanotechnology.

(3)

Optical materials.

(3)

Solder and soldering.

(3)

Chip scale packaging.

(2)

Electronic apparatus and appliances -- Reliability.

(2)

Electronics -- Materials -- Permeability.

(2)

Extreme environments.

(2)

Sealing (Technology)

(2)

Surfaces (Physics).

(2)

(1)

(1)

Aerospace engineering.

(1)

Amplifiers (Electronics).

(1)

Biomedical engineering.

(1)

(1)

Building materials.

(1)

COMPUTERS / Programming / Algorithms

(1)

Ceramic materials.

(1)

(1)

(1)

Classical Mechanics.

(1)

Contamination (Technology)

(1)

(1)

Dichtung (Technik)

(1)

Drugs -- Testing.

(1)

Electric connectors.

(1)

Electric lighting -- Equipment and supplies.

(1)

Electromagnetics & Microwaves

(1)

Electronic Packaging

(1)

Electronic apparatus and appliances -- Thermal properties.

(1)

Electronic ceramics.

(1)

Electronic circuits -- Handbooks, manuals, etc.

(1)

Electronic packaging -- Defects -- Prevention.

(1)

Electronic packaging -- Handbooks, manuals, etc.

(1)

Electronic packaging -- Materials.

(1)

Electronics -- Materials.

(1)

Elektronik aygıtlar ve aletler -- Tasarım ve yapım.

(1)

Elektronik paketleme -- Kusurlar -- Korunma.

(1)

Elektronik paketleme.

(1)

Elektronisches Bauelement.

(1)

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(1)

Engineering Mechanics.

(1)

Engineering design.

(1)

Environmental protection.

(1)

Environmental testing.

(1)

Fabrika sağlıklaştırımı.

(1)

Factory sanitation.

(1)

Field-effect transistors.

(1)

Gallium arsenide.

(1)

Green products.

(1)

Heat -- Transmission.

(1)

Interconnects (Integrated circuit technology) -- Design and construction.

(1)

Kontaminasyon (Teknoloji)

(1)

Light emitting diodes -- Computer simulation.

(1)

Light emitting diodes -- Design and construction.

(1)

Mechanics, Applied.

(1)

(1)

Microelectromechanical systems.

(1)

Microfabrication.

(1)

Micromechanics.

(1)

Microwave transistors.

(1)

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(1)

Mise sous boîtier (Microélectronique)

(1)

Mise sous boîtier (Électronique)

(1)

Mixing circuits.

(1)

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(1)

(1)

Nanostructured materials.

(1)

Optical detectors -- Industrial applications.

(1)

Optoelectronic devices.

(1)

Optoelectronics.

(1)

Optoelektronik.

(1)

Oscillators, Electric.

(1)

Particles (Nuclear physics).

(1)

Passive components.

(1)

(1)

Production management.

(1)

Production of electric energy or power.

(1)

Quality control -- Optical methods.

(1)

Sealing (Technology).

(1)

Semiconductor industry -- Production control.

(1)

Semiconductors -- Design and construction.

(1)

Semiconductors.

(1)

Solid Mechanics.

(1)

(1)

Space vehicles -- Electronic equipment -- Design and construction.

(1)

Structural Materials.

(1)

(1)

Systems engineering.

(1)

TECHNOLOGY / Engineering / Civil

(1)

TECHNOLOGY / Engineering / Mechanical

(1)

Telecommunication.

(1)

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13.

Recent Trends in VLSI and Semiconductor Packaging için kapak resmi

Recent Trends in VLSI and Semiconductor Packaging

Recent Trends in VLSI and Semiconductor Packaging

Yazar

Vasudeva Reddy, T., editor. Madhava Rao, K., editor.

Yer Numarası

TK7870.15

Elektronik Erişim

Taylor & Francis https://www.taylorfrancis.com/books/9781003616399
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf

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14.

PRACTICAL GUIDE FOR THE RELIABLE PACKAGING OF ELECTRONICS thermal and mechanical design and... analysis. için kapak resmi

PRACTICAL GUIDE FOR THE RELIABLE PACKAGING OF ELECTRONICS thermal and mechanical design and... analysis.

PRACTICAL GUIDE FOR THE RELIABLE PACKAGING OF ELECTRONICS thermal and mechanical design and... analysis.

Yazar

JAMNIA, ALI.

Yer Numarası

TK7870.15

Elektronik Erişim

Taylor & Francis https://www.taylorfrancis.com/books/9781003564485
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf

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15.

Electronic enclosures, housings and packages için kapak resmi

Electronic enclosures, housings and packages

Electronic enclosures, housings and packages

Yazar

Süli, Frank, author.

Yer Numarası

ONLINE

Elektronik Erişim

ScienceDirect https://www.sciencedirect.com/science/book/9780081023914

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16.

Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures için kapak resmi

Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures

Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures

Yazar

Voyiadjis, George Z. editor. SpringerLink (Online service)

Yer Numarası

ONLINE

Elektronik Erişim

https://doi.org/10.1007/978-1-4614-5589-9

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17.

Extreme environment electronics için kapak resmi

Extreme environment electronics

Extreme environment electronics

Yazar

Cressler, John D. Mantooth, H. Alan, 1963-

Yer Numarası

TK7870.24 .E97 2013

Elektronik Erişim

Click here to view.

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18.

Hermeticity of electronic packages için kapak resmi

Hermeticity of electronic packages

Hermeticity of electronic packages

Yazar

Greenhouse, Hal. Lowry, Robert (Robert K.), 1944- Romenesko, Bruce.

Yer Numarası

ONLINE

Elektronik Erişim

ScienceDirect http://www.sciencedirect.com/science/book/9781437778779

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19.

LED packaging for lighting applications design, manufacturing, and testing için kapak resmi

LED packaging for lighting applications design, manufacturing, and testing

LED packaging for lighting applications design, manufacturing, and testing

Yazar

Liu, S. (Sheng), 1963- Luo, Xiaobing, 1974-

Yer Numarası

ONLINE

Elektronik Erişim

Click here to view book
John Wiley http://dx.doi.org/10.1002/9780470827857
http://site.ebrary.com/lib/alltitles/Doc?id=10490643

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20.

MEMS/MOEMS packaging concepts, designs, materials, and processes için kapak resmi

MEMS/MOEMS packaging concepts, designs, materials, and processes

MEMS/MOEMS packaging concepts, designs, materials, and processes

Yazar

Gilleo, Ken.

Yer Numarası

ONLINE

Elektronik Erişim

Subscription required

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21.

Practical guide to the packaging of electronics : thermal and mechanical design and analysis için kapak resmi

Practical guide to the packaging of electronics : thermal and mechanical design and analysis

Practical guide to the packaging of electronics : thermal and mechanical design and analysis

Yazar

Jamnia, Ali, 1961- author.

Yer Numarası

TK7870.15 .J36 2009

Elektronik Erişim

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22.

Ceramic interconnect technology handbook için kapak resmi

Ceramic interconnect technology handbook

Ceramic interconnect technology handbook

Yazar

Barlow, Fred D. Elshabini, Aicha.

Yer Numarası

TK7871.15 .C4 C44 2007

Elektronik Erişim

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23.

Optical inspection of microsystems için kapak resmi

Optical inspection of microsystems

Optical inspection of microsystems

Yazar

Osten, Wolfgang.

Yer Numarası

TS156.2 .O652 2007

Elektronik Erişim

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24.

Drug products for clinical trials için kapak resmi

Drug products for clinical trials

Drug products for clinical trials

Yazar

Monkhouse, Donald C. Carney, Charles (Charles F.) Clark, Jim.

Yer Numarası

RM301.27 .D796 2006

Elektronik Erişim

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