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Dagur, Arvind.
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Ji, Liang-Wen, editor.
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(2)
Li, Kenli, author.
(2)
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1. 
The psychology of artificial intelligence için kapak resmi
The psychology of artificial intelligence
Yazar 
Prescott, Tony J., author.
Yer Numarası 
Q334.7
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003088660
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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2. 
ARTIFICIAL INTELLIGENCE AND INFORMATION TECHNOLOGIES. Volume 2 Proceedings of the International Conference on Artificial Intelligence and Information Technologies , 3-4 November 2023, Samarkand, Uzbekistan / edited by Arvind Dagur and Dhirendra Kumar Shukla [and 3 others]. için kapak resmi
ARTIFICIAL INTELLIGENCE AND INFORMATION TECHNOLOGIES. Volume 2 Proceedings of the International Conference on Artificial Intelligence and Information Technologies , 3-4 November 2023, Samarkand, Uzbekistan / edited by Arvind Dagur and Dhirendra Kumar Shukla [and 3 others].
Yazar 
Dagur, Arvind. Shukla, Dhirendra Kumar.
Yer Numarası 
Q335
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003510833
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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3. 
AI FOR RADIOLOGY için kapak resmi
AI FOR RADIOLOGY
Yazar 
Marques, Oge.
Yer Numarası 
R855.3
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003110767
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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4. 
ARTIFICIAL INTELLIGENCE AND INFORMATION TECHNOLOGIES Proceedings of the 1st International Conference on Artificial Intelligence and Information Technologies (ICAIIT 2023), 3-4 November 2023, Samarkand, Uzbekistan. Volume 1. için kapak resmi
ARTIFICIAL INTELLIGENCE AND INFORMATION TECHNOLOGIES Proceedings of the 1st International Conference on Artificial Intelligence and Information Technologies (ICAIIT 2023), 3-4 November 2023, Samarkand, Uzbekistan. Volume 1.
Yazar 
International Conference on Artificial Intelligence and Information Technologies (1st : 2023 : Samarkand, Uzbekistan) Dagur, Arvind.
Yer Numarası 
Q335
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781032700502
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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5. 
Disruptive technologies in Computing and Communication Systems : Proceedings of the 1st International Conference on Disruptive technologies in Computing and Communication Systems için kapak resmi
Disruptive technologies in Computing and Communication Systems : Proceedings of the 1st International Conference on Disruptive technologies in Computing and Communication Systems
Yazar 
International Conference on Disruptive Technologies in Computing and Communication Systems (1st : 2023) Mohan, K. Venkata Murali, editor Suresh Babu, M., editor.
Yer Numarası 
TK7885 .A1
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781032665535
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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6. 
Software security : concepts & practices için kapak resmi
Software security : concepts & practices
Yazar 
Khan, Suhel Ahmad, author. Kumar, Rajeev, author. Khan, R. A. (Raees Ahmad), author.
Yer Numarası 
QA76.76 .D47
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003330516
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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7. 
AI and education in China : imagining the future, excavating the past için kapak resmi
AI and education in China : imagining the future, excavating the past
Yazar 
Knox, Jeremy, author.
Yer Numarası 
LB1028.3
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003375135
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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8. 
Technological prospects and social applications of society 5.0 için kapak resmi
Technological prospects and social applications of society 5.0
Yazar 
Sharma, Lavanya, editor. Garg, Pradeep K., editor.
Yer Numarası 
T14.5
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003324720
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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9. 
Data science : techniques and intelligent applications için kapak resmi
Data science : techniques and intelligent applications
Yazar 
Chavan, Pallavi, editor. Mahalle, Parikshit N., editor. Mangrulkar, Ramchandra, editor. Williams, Idongesit, editor.
Yer Numarası 
QA76.9 .B45
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003283249
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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10. 
Workflow scheduling on computing systems için kapak resmi
Workflow scheduling on computing systems
Yazar 
Li, Kenli, author.
Yer Numarası 
HD62.175
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003307273
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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11. 
Functional safety for embedded systems için kapak resmi
Functional safety for embedded systems
Yazar 
Xie, Guoqi, 1983- author. Zhang, Yawen, author. Li, Renfa, author. Li, Kenli, author. Li, Keqin, 1963- author.
Yer Numarası 
TK7895 .E42
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003391517
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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12. 
Winning together : a UX researcher's guide to building strong cross-functional relationships için kapak resmi
Winning together : a UX researcher's guide to building strong cross-functional relationships
Yazar 
Srivastava, Sonal, author.
Yer Numarası 
Q180.55 .M4
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003391036
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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