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SpringerLink (Online service)

(6)

Brown, William D., 1943-

(2)

Greenhouse, Hal.

(2)

Ulrich, Richard K. (Richard Kevin), 1955-

(2)

Agarwal, Rakish, author.

(1)

Avtgis, Alexander W.

(1)

Barlow, Fred D.

(1)

Blackwell, Glenn R.

(1)

Carney, Charles (Charles F.)

(1)

(1)

Cressler, John D.

(1)

Del Castillo, Enrique.

(1)

Dishongh, Terrance J., author.

(1)

Dorf, Richard C.

(1)

Elshabini, Aicha.

(1)

Gerlach, Gerald. editor.

(1)

(1)

Hurwitz, Arnon Max.

(1)

Jamnia, Ali, 1961- author.

(1)

Javadpour, Sirus, author.

(1)

Lee, Ning-Cheng.

(1)

(1)

Lee, Y. C. editor.

(1)

Li, Yi (Grace). editor.

(1)

Licari, James J., 1930-

(1)

Liu, S. (Sheng), 1963-

(1)

Liu, Yong. author.

(1)

Lowry, Robert (Robert K.), 1944-

(1)

Luo, Xiaobing, 1974-

(1)

Mahajan, Rahul, author.

(1)

Mantooth, H. Alan, 1963-

(1)

McCluskey, F. Patrick, author.

(1)

Megow, William F.

(1)

Monkhouse, Donald C.

(1)

Moon, Kyoung-Sik. editor.

(1)

(1)

Osten, Wolfgang.

(1)

Pecht, Michael, author.

(1)

Pecht, Michael.

(1)

Pengelly, Raymond S.

(1)

Puttlitz, Karl J.

(1)

Remsburg, Ralph., author.

(1)

Romenesko, Bruce.

(1)

Stalter, Kathleen A.

(1)

Suganuma, Katsuaki.

(1)

Suhir, E. editor.

(1)

Suhir, Ephraim.

(1)

Swanson, Dale W.

(1)

Süli, Frank, author.

(1)

Tai-Ran Hsu, ed.

(1)

Tong, Xingcun Colin. author.

(1)

Villanucci, Robert S., 1944-

(1)

Voyiadjis, George Z. editor.

(1)

Walker, C. A. (Colin A.)

(1)

Whitaker, Jerry C.

(1)

Wolter, Klaus-Jürgen. editor.

(1)

(1)

Wong, C. P. editor.

(1)

Wong, C.P. editor.

(1)

Tümünü genişlet

Dil

(32)

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(2)

(2)

(2)

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(1)

(1)

(1)

(1)

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(1)

(1)

(1)

(1)

Tümünü genişlet

Konu

Electronic packaging.

(15)

(4)

Electronic apparatus and appliances -- Design and construction.

(3)

Electronic books.

(3)

(3)

Microelectronic packaging.

(3)

Microelectronics.

(3)

Nanotechnology.

(3)

Optical materials.

(3)

Solder and soldering.

(3)

Chip scale packaging.

(2)

Electronics -- Materials -- Permeability.

(2)

Sealing (Technology)

(2)

Surfaces (Physics).

(2)

(1)

(1)

Aerospace engineering.

(1)

Amplifiers (Electronics).

(1)

Biomedical engineering.

(1)

(1)

Building materials.

(1)

Ceramic materials.

(1)

(1)

(1)

Classical Mechanics.

(1)

Contamination (Technology)

(1)

(1)

Dichtung (Technik)

(1)

Drugs -- Testing.

(1)

Electric connectors.

(1)

Electric lighting -- Equipment and supplies.

(1)

Electromagnetics & Microwaves

(1)

Electronic Packaging

(1)

Electronic apparatus and appliances -- Reliability.

(1)

Electronic apparatus and appliances -- Thermal properties.

(1)

Electronic ceramics.

(1)

Electronic circuits -- Handbooks, manuals, etc.

(1)

Electronic packaging -- Defects -- Prevention.

(1)

Electronic packaging -- Handbooks, manuals, etc.

(1)

Electronic packaging -- Materials.

(1)

Electronics -- Materials.

(1)

Elektronik aygıtlar ve aletler -- Tasarım ve yapım.

(1)

Elektronik paketleme -- Kusurlar -- Korunma.

(1)

Elektronik paketleme.

(1)

Elektronisches Bauelement.

(1)

Engineering -- Handbooks, manuals, etc.

(1)

Engineering Mechanics.

(1)

Engineering design.

(1)

Environmental protection.

(1)

Environmental testing.

(1)

Extreme environments.

(1)

Fabrika sağlıklaştırımı.

(1)

Factory sanitation.

(1)

Field-effect transistors.

(1)

Gallium arsenide.

(1)

Green products.

(1)

Heat -- Transmission.

(1)

Interconnects (Integrated circuit technology) -- Design and construction.

(1)

Kontaminasyon (Teknoloji)

(1)

Light emitting diodes -- Computer simulation.

(1)

Light emitting diodes -- Design and construction.

(1)

Mechanics, Applied.

(1)

(1)

Microelectromechanical systems.

(1)

Microfabrication.

(1)

Micromechanics.

(1)

Microwave transistors.

(1)

Mikroelektronik.

(1)

Mise sous boîtier (Microélectronique)

(1)

Mise sous boîtier (Électronique)

(1)

Mixing circuits.

(1)

Moire method -- Case studies.

(1)

(1)

Nanostructured materials.

(1)

Optical detectors -- Industrial applications.

(1)

Optoelectronic devices.

(1)

Optoelectronics.

(1)

Optoelektronik.

(1)

Oscillators, Electric.

(1)

Particles (Nuclear physics).

(1)

Passive components.

(1)

(1)

Production management.

(1)

Production of electric energy or power.

(1)

Quality control -- Optical methods.

(1)

Sealing (Technology).

(1)

Semiconductor industry -- Production control.

(1)

Semiconductors -- Design and construction.

(1)

Semiconductors.

(1)

Solid Mechanics.

(1)

(1)

Structural Materials.

(1)

(1)

Systems engineering.

(1)

Telecommunication.

(1)

Tümünü genişlet

Materyal Türü

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25.

MEMS Packaging için kapak resmi

Yazar

Tai-Ran Hsu, ed.

Yer Numarası

ONLINE

Elektronik Erişim

http://dx.doi.org/10.1049/PBEP003E

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26.

Handbook of Moire measurement için kapak resmi

Handbook of Moire measurement

Handbook of Moire measurement

Yazar

Walker, C. A. (Colin A.)

Yer Numarası

QC415 .H27 2004

Elektronik Erişim

Click here to view.

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27.

Lead-free soldering in electronics : science, technology and environmental impact için kapak resmi

Lead-free soldering in electronics : science, technology and environmental impact

Lead-free soldering in electronics : science, technology and environmental impact

Yazar

Suganuma, Katsuaki.

Yer Numarası

TK7870.15 .L43 2004

Elektronik Erişim

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28.

Handbook of lead-free solder technology for microelectronic assemblies için kapak resmi

Handbook of lead-free solder technology for microelectronic assemblies

Handbook of lead-free solder technology for microelectronic assemblies

Yazar

Puttlitz, Karl J. Stalter, Kathleen A.

Yer Numarası

TK7870.15 .H3657 2004

Elektronik Erişim

Click here to view.

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29.

Reflow soldering processes SMT, BGA, CSP and flip chip technologies için kapak resmi

Reflow soldering processes SMT, BGA, CSP and flip chip technologies

Reflow soldering processes SMT, BGA, CSP and flip chip technologies

Yazar

Lee, Ning-Cheng.

Yer Numarası

ONLINE

Elektronik Erişim

Volltext http://www.sciencedirect.com/science/book/9780750672184

Format:

Durum

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30.

Thermal design of electronic equipment için kapak resmi

Thermal design of electronic equipment

Thermal design of electronic equipment

Yazar

Remsburg, Ralph., author.

Yer Numarası

TK7870.25 .R46 2001

Elektronik Erişim

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31.

Run-to-run control in semiconductor manufacturing için kapak resmi

Run-to-run control in semiconductor manufacturing

Run-to-run control in semiconductor manufacturing

Yazar

Del Castillo, Enrique. Hurwitz, Arnon Max. Moyne, James.

Yer Numarası

TK7871.85 .R863 2001

Elektronik Erişim

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Format:

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32.

Hermeticity of electronic packages için kapak resmi

Hermeticity of electronic packages

Hermeticity of electronic packages

Yazar

Greenhouse, Hal.

Yer Numarası

ONLINE

Elektronik Erişim

ScienceDirect http://www.sciencedirect.com/science/book/9780815514350

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33.

Electronic techniques : shop practices and construction için kapak resmi

Electronic techniques : shop practices and construction

Electronic techniques : shop practices and construction

Yazar

Villanucci, Robert S., 1944- Avtgis, Alexander W. Megow, William F.

Yer Numarası

TK7836 .V55 1996

Format:

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34.

Microwave Field-Effect Transistors Theory, design and applications için kapak resmi

Microwave Field-Effect Transistors Theory, design and applications

Microwave Field-Effect Transistors Theory, design and applications

Yazar

Pengelly, Raymond S.

Yer Numarası

ONLINE

Elektronik Erişim

http://dx.doi.org/10.1049/SBEW016E

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