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Yazar

SpringerLink (Online service)

(6)

Brown, William D., 1943-

(2)

Greenhouse, Hal.

(2)

Ulrich, Richard K. (Richard Kevin), 1955-

(2)

Agarwal, Rakish, author.

(1)

Avtgis, Alexander W.

(1)

Barlow, Fred D.

(1)

Bath, Jasbir, editor.

(1)

Blackwell, Glenn R.

(1)

Carney, Charles (Charles F.)

(1)

Cepeda-Rizo, Juan, author.

(1)

Chen, Chih, 1970- author.

(1)

Chen, Hung-Ming, author.

(1)

(1)

Cressler, John D.

(1)

Del Castillo, Enrique.

(1)

Dishongh, Terrance J., author.

(1)

Domingo, George, 1937- author.

(1)

Dorf, Richard C.

(1)

Elshabini, Aicha.

(1)

Gayle, Jeremiah, author.

(1)

Gerlach, Gerald. editor.

(1)

(1)

Huang, Wei, editor.

(1)

Hurwitz, Arnon Max.

(1)

(1)

Jamnia, Ali, 1961- author.

(1)

Javadpour, Sirus, author.

(1)

Keser, Beth, 1971- editor.

(1)

Kroehnert, Steffen, 1970- editor.

(1)

Lee, Ning-Cheng.

(1)

(1)

Lee, Y. C. editor.

(1)

Li, Yi (Grace). editor.

(1)

Licari, James J., 1930-

(1)

Liu, S. (Sheng), 1963-

(1)

Liu, Yong. author.

(1)

Lorenzelli, Leandro, author.

(1)

Lowry, Robert (Robert K.), 1944-

(1)

Luo, Xiaobing, 1974-

(1)

Madhava Rao, K., editor.

(1)

Mahajan, Rahul, author.

(1)

Manjakkal, Libu, author.

(1)

Manning, Louise, editor.

(1)

Mantooth, H. Alan, 1963-

(1)

Martín, Ferran, 1965- author.

(1)

McCluskey, F. Patrick, author.

(1)

Megow, William F.

(1)

Meng, Hong, editor.

(1)

Monkhouse, Donald C.

(1)

Moon, Kyoung-Sik. editor.

(1)

(1)

Muñoz-Enano, Jonathan, author.

(1)

Nakamura, Shozo (Professor Emeritus), author.

(1)

Osten, Wolfgang.

(1)

Pecht, Michael, author.

(1)

Pecht, Michael.

(1)

Pengelly, Raymond S.

(1)

Puttlitz, Karl J.

(1)

Ravich, Joshua, author.

(1)

Remsburg, Ralph., author.

(1)

Romenesko, Bruce.

(1)

Sharif, Ahmed, editor.

(1)

Stalter, Kathleen A.

(1)

Su, Lijuan, author.

(1)

Suganuma, Katsuaki.

(1)

Suhir, E. editor.

(1)

Suhir, Ephraim.

(1)

Swanson, Dale W.

(1)

Süli, Frank, author.

(1)

Tai-Ran Hsu, ed.

(1)

Tenhunen, Hannu, author.

(1)

Tian, Xingyou, editor.

(1)

Tong, Xingcun Colin. author.

(1)

Tu, K. N. (King-Ning), 1937- author.

(1)

Vasudeva Reddy, T., editor.

(1)

Villanucci, Robert S., 1944-

(1)

Voyiadjis, George Z. editor.

(1)

Vélez, Paris, author.

(1)

Walker, C. A. (Colin A.)

(1)

Whitaker, Jerry C.

(1)

Willander, M., author.

(1)

Wolter, Klaus-Jürgen. editor.

(1)

(1)

Wong, C. P. editor.

(1)

Wong, C.P. editor.

(1)

Zapka, Werner, editor.

(1)

Zha, Jun-Wei, editor.

(1)

Zheng, Li-Rong, author.

(1)

Zou, Zhuo, author.

(1)

Tümünü genişlet

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Yayın Yılı

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Tümünü genişlet

Konu

Electronic packaging.

(22)

Electronic books.

(11)

(8)

TECHNOLOGY & ENGINEERING.

(6)

Mise sous boîtier (Électronique)

(5)

Microelectronics.

(4)

Solder and soldering.

(4)

Chip scale packaging.

(3)

Electronic apparatus and appliances -- Design and construction.

(3)

(3)

Extreme environments.

(3)

Microelectronic packaging.

(3)

Nanotechnology.

(3)

Optical materials.

(3)

TECHNOLOGY & ENGINEERING -- Mechanical.

(3)

(2)

Electronic apparatus and appliances -- Reliability.

(2)

Electronic packaging

(2)

Electronic packaging -- Materials.

(2)

Electronics -- Materials -- Permeability.

(2)

(2)

(2)

Sealing (Technology)

(2)

Semiconductors.

(2)

Surfaces (Physics).

(2)

(1)

(1)

Aerospace engineering.

(1)

Aliments -- Industrie et commerce -- Grande-Bretagne -- Qualité -- Contrôle.

(1)

Amplifiers (Electronics).

(1)

(1)

Biomedical engineering.

(1)

(1)

Boîtiers à puce.

(1)

Building materials.

(1)

COMPUTERS / Programming / Algorithms

(1)

Capteurs intelligents.

(1)

Ceramic materials.

(1)

(1)

Chip scale packaging

(1)

Circuits imprimés.

(1)

Circuits intégrés -- Intégration sur la plaquette.

(1)

Circuits intégrés.

(1)

(1)

Classical Mechanics.

(1)

Conducting polymers.

(1)

Contamination (Technology)

(1)

(1)

Dichtung (Technik)

(1)

(1)

Drugs -- Testing.

(1)

Détecteurs à micro-ondes.

(1)

Eau -- Qualité -- Mesure.

(1)

Eau -- Qualité -- Télédétection.

(1)

Electric connectors.

(1)

Electric lighting -- Equipment and supplies.

(1)

(1)

Electromagnetics & Microwaves

(1)

Electronic Packaging

(1)

Electronic apparatus and appliances

(1)

Electronic apparatus and appliances -- Thermal properties.

(1)

Electronic apparatus and appliances.

(1)

Electronic ceramics.

(1)

Electronic circuits -- Handbooks, manuals, etc.

(1)

Electronic packaging -- Defects -- Prevention.

(1)

Electronic packaging -- Handbooks, manuals, etc.

(1)

Electronics -- Materials -- Effect of temperature on.

(1)

Electronics -- Materials.

(1)

Elektronik aygıtlar ve aletler -- Tasarım ve yapım.

(1)

Elektronik paketleme -- Kusurlar -- Korunma.

(1)

Elektronik paketleme.

(1)

Elektronisches Bauelement.

(1)

Engineering -- Handbooks, manuals, etc.

(1)

Engineering Mechanics.

(1)

Engineering design.

(1)

Environmental protection.

(1)

Environmental testing.

(1)

(1)

Extreme environments

(1)

Fabrika sağlıklaştırımı.

(1)

Factory sanitation.

(1)

Field-effect transistors.

(1)

Food industry and trade -- Great Britain -- Quality control.

(1)

Food industry and trade -- Quality control

(1)

Gallium arsenide.

(1)

(1)

Green products.

(1)

Heat -- Transmission.

(1)

Heat resistant materials

(1)

Heat resistant materials.

(1)

Ink-jet printing

(1)

Ink-jet printing.

(1)

Integrated circuits -- Wafer-scale integration

(1)

Integrated circuits -- Wafer-scale integration.

(1)

Intelligent sensors

(1)

Intelligent sensors.

(1)

Interconnects (Integrated circuit technology) -- Design and construction.

(1)

Kontaminasyon (Teknoloji)

(1)

Light emitting diodes -- Computer simulation.

(1)

Light emitting diodes -- Design and construction.

(1)

Materials at high temperatures

(1)

Materials at high temperatures.

(1)

Matériaux réfractaires.

(1)

Matériaux à hautes températures.

(1)

Mechanics, Applied.

(1)

(1)

Microelectromechanical systems.

(1)

Microfabrication.

(1)

Micromechanics.

(1)

Microwave detectors

(1)

Microwave detectors.

(1)

Microwave transistors.

(1)

Mikroelektronik.

(1)

Milieux extrêmes.

(1)

Mise sous boîtier (Microélectronique)

(1)

Mise sous boîtier (Électronique) -- Matériaux.

(1)

Mixing circuits.

(1)

Moire method -- Case studies.

(1)

(1)

Nanostructured materials.

(1)

Optical detectors -- Industrial applications.

(1)

Optoelectronic devices.

(1)

Optoelectronics.

(1)

Optoelektronik.

(1)

Oscillators, Electric.

(1)

Particles (Nuclear physics).

(1)

Passive components.

(1)

(1)

(1)

Polymères conducteurs.

(1)

Printed electronics

(1)

Printed electronics.

(1)

Production management.

(1)

Production of electric energy or power.

(1)

Quality Control.

(1)

Quality control -- Optical methods.

(1)

Sealing (Technology).

(1)

Semi-conducteurs.

(1)

Semiconductor industry -- Production control.

(1)

(1)

Semiconductors -- Design and construction.

(1)

(1)

Silicon -- Electric properties

(1)

Silicon -- Electric properties.

(1)

Silicones -- Propriétés électroniques.

(1)

Solder and soldering

(1)

Solid Mechanics.

(1)

Solid state electronics

(1)

Solid state electronics.

(1)

(1)

(1)

Space vehicles -- Electronic equipment -- Design and construction.

(1)

Structural Materials.

(1)

(1)

Systems engineering.

(1)

Systèmes électroniques.

(1)

TECHNOLOGY & ENGINEERING -- Electronics -- Semiconductors.

(1)

TECHNOLOGY & ENGINEERING -- Food Science.

(1)

TECHNOLOGY / Engineering / Civil

(1)

TECHNOLOGY / Engineering / Mechanical

(1)

Telecommunication.

(1)

(1)

Water quality -- Measurement

(1)

Water quality -- Measurement.

(1)

Water quality -- Remote sensing

(1)

Water quality -- Remote sensing.

(1)

(1)

(1)

(1)

Électronique -- Matériaux -- Effets de la température sur.

(1)

Électronique de l'état solide.

(1)

Tümünü genişlet

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25.

Electronic enclosures, housings and packages için kapak resmi

Electronic enclosures, housings and packages

Electronic enclosures, housings and packages

Yazar

Süli, Frank, author.

Yer Numarası

ONLINE

Elektronik Erişim

ScienceDirect https://www.sciencedirect.com/science/book/9780081023914

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26.

Advances in embedded and fan-out wafer level packaging technologies için kapak resmi

Advances in embedded and fan-out wafer level packaging technologies

Advances in embedded and fan-out wafer level packaging technologies

Yazar

Keser, Beth, 1971- editor. Kroehnert, Steffen, 1970- editor.

Yer Numarası

TK7870.17 .A38 2019

Elektronik Erişim

https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991

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27.

Harsh environment electronics : interconnect materials and performance assessment için kapak resmi

Harsh environment electronics : interconnect materials and performance assessment

Harsh environment electronics : interconnect materials and performance assessment

Yazar

Sharif, Ahmed, editor.

Yer Numarası

TK7871

Elektronik Erişim

https://onlinelibrary.wiley.com/doi/book/10.1002/9783527813964

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28.

Smart electronic systems : heterogeneous integration of silicon and printed electronics için kapak resmi

Smart electronic systems : heterogeneous integration of silicon and printed electronics

Smart electronic systems : heterogeneous integration of silicon and printed electronics

Yazar

Zheng, Li-Rong, author. Tenhunen, Hannu, author. Zou, Zhuo, author.

Yer Numarası

TK7872 .P75

Elektronik Erişim

https://onlinelibrary.wiley.com/doi/book/10.1002/9783527691685

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29.

Food and drink--good manufacturing practice : a guide to its responsible management için kapak resmi

Food and drink--good manufacturing practice : a guide to its responsible management

Food and drink--good manufacturing practice : a guide to its responsible management

Yazar

Manning, Louise, editor.

Yer Numarası

TP369 .G7

Elektronik Erişim

https://onlinelibrary.wiley.com/doi/book/10.1002/9781119388494

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30.

Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures için kapak resmi

Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures

Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures

Yazar

Voyiadjis, George Z. editor. SpringerLink (Online service)

Yer Numarası

ONLINE

Elektronik Erişim

https://doi.org/10.1007/978-1-4614-5589-9

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31.

Extreme environment electronics için kapak resmi

Extreme environment electronics

Extreme environment electronics

Yazar

Cressler, John D. Mantooth, H. Alan, 1963-

Yer Numarası

TK7870.24 .E97 2013

Elektronik Erişim

Click here to view.

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32.

Hermeticity of electronic packages için kapak resmi

Hermeticity of electronic packages

Hermeticity of electronic packages

Yazar

Greenhouse, Hal. Lowry, Robert (Robert K.), 1944- Romenesko, Bruce.

Yer Numarası

ONLINE

Elektronik Erişim

ScienceDirect http://www.sciencedirect.com/science/book/9781437778779

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33.

MEMS/MOEMS packaging concepts, designs, materials, and processes için kapak resmi

MEMS/MOEMS packaging concepts, designs, materials, and processes

MEMS/MOEMS packaging concepts, designs, materials, and processes

Yazar

Gilleo, Ken.

Yer Numarası

ONLINE

Elektronik Erişim

Subscription required

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34.

LED packaging for lighting applications design, manufacturing, and testing için kapak resmi

LED packaging for lighting applications design, manufacturing, and testing

LED packaging for lighting applications design, manufacturing, and testing

Yazar

Liu, S. (Sheng), 1963- Luo, Xiaobing, 1974-

Yer Numarası

ONLINE

Elektronik Erişim

Click here to view book
John Wiley http://dx.doi.org/10.1002/9780470827857
http://site.ebrary.com/lib/alltitles/Doc?id=10490643

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35.

Practical guide to the packaging of electronics : thermal and mechanical design and analysis için kapak resmi

Practical guide to the packaging of electronics : thermal and mechanical design and analysis

Practical guide to the packaging of electronics : thermal and mechanical design and analysis

Yazar

Jamnia, Ali, 1961- author.

Yer Numarası

TK7870.15 .J36 2009

Elektronik Erişim

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36.

Ceramic interconnect technology handbook için kapak resmi

Ceramic interconnect technology handbook

Ceramic interconnect technology handbook

Yazar

Barlow, Fred D. Elshabini, Aicha.

Yer Numarası

TK7871.15 .C4 C44 2007

Elektronik Erişim

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