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461 sonuç bulundu Arama sonuçlarına abone ol
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1. 
Intelligent Systems and Applications Select Proceedings of ICISA 2022 için kapak resmi
Intelligent Systems and Applications Select Proceedings of ICISA 2022
Yazar 
Kulkarni, Anand J. editor. Mirjalili, Seyedali. editor. Udgata, Siba Kumar. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-19-6581-4
Format: 
Durum 
Çevrimiçi Kütüphane~1
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2. 
Recent Trends in Image Processing and Pattern Recognition 5th International Conference, RTIP2R 2022, Kingsville, TX, USA, December 1-2, 2022, Revised Selected Papers için kapak resmi
Recent Trends in Image Processing and Pattern Recognition 5th International Conference, RTIP2R 2022, Kingsville, TX, USA, December 1-2, 2022, Revised Selected Papers
Yazar 
Santosh, KC. editor. Goyal, Ayush. editor. Aouada, Djamila. editor. Makkar, Aaisha. editor. Chiang, Yao-Yi. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-23599-3
Format: 
Durum 
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3. 
Streaming Linked Data From Vision to Practice için kapak resmi
Streaming Linked Data From Vision to Practice
Yazar 
Tommasini, Riccardo. author. Bonte, Pieter. author. Spiga, Fabiano. author. Della Valle, Emanuele. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-15371-6
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4. 
Health Information Processing 8th China Conference, CHIP 2022, Hangzhou, China, October 21-23, 2022, Revised Selected Papers için kapak resmi
Health Information Processing 8th China Conference, CHIP 2022, Hangzhou, China, October 21-23, 2022, Revised Selected Papers
Yazar 
Tang, Buzhou. editor. Chen, Qingcai. editor. Lin, Hongfei. editor. Wu, Fei. editor. Liu, Lei. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-19-9865-2
Format: 
Durum 
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5. 
Artificial Intelligence in China Proceedings of the 4th International Conference on Artificial Intelligence in China için kapak resmi
Artificial Intelligence in China Proceedings of the 4th International Conference on Artificial Intelligence in China
Yazar 
Liang, Qilian. editor. Wang, Wei. editor. Mu, Jiasong. editor. Liu, Xin. editor. Na, Zhenyu. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-99-1256-8
Format: 
Durum 
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6. 
Smart Technologies, Systems and Applications 3rd International Conference, SmartTech-IC 2022, Cuenca, Ecuador, November 16-18, 2022, Revised Selected Papers için kapak resmi
Smart Technologies, Systems and Applications 3rd International Conference, SmartTech-IC 2022, Cuenca, Ecuador, November 16-18, 2022, Revised Selected Papers
Yazar 
Narváez, Fabián R. editor. Urgilés, Fernando. editor. Bastos-Filho, Teodiano Freire. editor. Salgado-Guerrero, Juan Pablo. editor. (orcid) SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-32213-6
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7. 
Computer-Aided Architectural Design. INTERCONNECTIONS: Co-computing Beyond Boundaries 20th International Conference, CAAD Futures 2023, Delft, The Netherlands, July 5-7, 2023, Selected Papers için kapak resmi
Computer-Aided Architectural Design. INTERCONNECTIONS: Co-computing Beyond Boundaries 20th International Conference, CAAD Futures 2023, Delft, The Netherlands, July 5-7, 2023, Selected Papers
Yazar 
Turrin, Michela. editor. Andriotis, Charalampos. editor. Rafiee, Azarakhsh. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-37189-9
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8. 
Advances in Computing 16th Colombian Congress, CCC 2022, Armenia, Colombia, October 17-21, 2022, Revised Selected Papers için kapak resmi
Advances in Computing 16th Colombian Congress, CCC 2022, Armenia, Colombia, October 17-21, 2022, Revised Selected Papers
Yazar 
Agredo-Delgado, Vanessa. editor. Ruiz, Pablo H. editor. (orcid) Ruiz Gaona, Alexandra. editor. Villegas Ramírez, María Lili. editor. Giraldo Orozco, William Joseph. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-36357-3
Format: 
Durum 
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9. 
Intelligent Systems and Machine Learning First EAI International Conference, ICISML 2022, Hyderabad, India, December 16-17, 2022, Proceedings, Part I için kapak resmi
Intelligent Systems and Machine Learning First EAI International Conference, ICISML 2022, Hyderabad, India, December 16-17, 2022, Proceedings, Part I
Yazar 
Nandan Mohanty, Sachi. editor. Garcia Diaz, Vicente. editor. Satish Kumar, G. A. E. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-35078-8
Format: 
Durum 
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10. 
Intelligent Systems and Machine Learning First EAI International Conference, ICISML 2022, Hyderabad, India, December 16-17, 2022, Proceedings, Part II için kapak resmi
Intelligent Systems and Machine Learning First EAI International Conference, ICISML 2022, Hyderabad, India, December 16-17, 2022, Proceedings, Part II
Yazar 
Nandan Mohanty, Sachi. editor. Garcia Diaz, Vicente. editor. Satish Kumar, G. A. E. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-35081-8
Format: 
Durum 
Çevrimiçi Kütüphane~1
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Kopya:
11. 
Enterprise, Business-Process and Information Systems Modeling 24th International Conference, BPMDS 2023, and 28th International Conference, EMMSAD 2023, Zaragoza, Spain, June 12-13, 2023, Proceedings için kapak resmi
Enterprise, Business-Process and Information Systems Modeling 24th International Conference, BPMDS 2023, and 28th International Conference, EMMSAD 2023, Zaragoza, Spain, June 12-13, 2023, Proceedings
Yazar 
van der Aa, Han. editor. Bork, Dominik. editor. (orcid) Proper, Henderik A. editor. Schmidt, Rainer. editor. (orcid) SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-34241-7
Format: 
Durum 
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12. 
Intelligent Multimedia Signal Processing for Smart Ecosystems için kapak resmi
Intelligent Multimedia Signal Processing for Smart Ecosystems
Yazar 
Parah, Shabir A. editor. Hurrah, Nasir N. editor. Khan, Ekram. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-34873-0
Format: 
Durum 
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