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Koretsky, Robert, author.
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Lam, Artde Donald Kin-Tak, editor.
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Aamir, Muhammad.
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Bazai, Sibghat Ullah.
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236 sonuç bulundu Arama sonuçlarına abone ol
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1. 
The Rise of Intelligent Machines : A Multi-Disciplinary Perspective from Industry and Impact on Higher Education için kapak resmi
The Rise of Intelligent Machines : A Multi-Disciplinary Perspective from Industry and Impact on Higher Education
Yazar 
Patel, Nadya Shaznay. Indurkhya, Nitin.
Yer Numarası 
Q334 .R57 2025
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003469551
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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2. 
Evolution and advances in computing technologies for Industry 6.0 : technology, practices, and challenges için kapak resmi
Evolution and advances in computing technologies for Industry 6.0 : technology, practices, and challenges
Yazar 
Reddy, C. Kishor Kumar, editor. Doss, Srinath, editor. Khan, Surbhi Bhatia, editor. Alqhatani, Abdulmajeed, editor.
Yer Numarası 
T59.6
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003503934
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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3. 
QUANTUM MACHINE LEARNING a modern approach. için kapak resmi
QUANTUM MACHINE LEARNING a modern approach.
Yazar 
Karthikeyan, S. (Computer scientist)
Yer Numarası 
Q325.5
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003429654
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4. 
METAHEURISTICS AND REINFORCEMENT TECHNIQUES FOR SMART SENSOR APPLICATIONS için kapak resmi
METAHEURISTICS AND REINFORCEMENT TECHNIQUES FOR SMART SENSOR APPLICATIONS
Yazar 
Sinha, Adwitiya. Manju. Singh, Samayveer.
Yer Numarası 
TK7871.676
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003427780
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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5. 
Why data science projects fail : the harsh realities of implementing AI and analytics, without the hype için kapak resmi
Why data science projects fail : the harsh realities of implementing AI and analytics, without the hype
Yazar 
Gray, Doug (Douglas A.), author. Shellsear, Evan, author.
Yer Numarası 
QA76.9 .Q36
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781032661360
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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6. 
AI for understanding human conversations için kapak resmi
AI for understanding human conversations
Yazar 
Neuman, Yair, 1968- author.
Yer Numarası 
P95.45
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003591047
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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7. 
INDUSTRY 4.0 WITH MODERN TECHNOLOGY proceedings of the International Conference on Emerging Trends in Engineering and Technology-Industry 4.0 (ETETI-2023), IGIT Sarang, Odisha, India. için kapak resmi
INDUSTRY 4.0 WITH MODERN TECHNOLOGY proceedings of the International Conference on Emerging Trends in Engineering and Technology-Industry 4.0 (ETETI-2023), IGIT Sarang, Odisha, India.
Yazar 
International Conference on Emerging Trends in Engineering and Technology-Industry 4.0 (2023 : Odisha, India) Sethi, Srinivas.
Yer Numarası 
T59.6
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003450924
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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8. 
Intelligent Circuits and Systems for SDG 3 - Good Health and well-being : proceedings of the International Conference on Intelligent Circuits and Systems (ICICS 2023), October 12-13th, 2023, Lovely Professional University, India için kapak resmi
Intelligent Circuits and Systems for SDG 3 - Good Health and well-being : proceedings of the International Conference on Intelligent Circuits and Systems (ICICS 2023), October 12-13th, 2023, Lovely Professional University, India
Yazar 
International Conference on Intelligent Circuits and Systems (2023 : New Delhi, India), issuing body. Dharman, Bhaveshkumar Choithram, editor. Tripathi, Suman Lata, editor.
Yer Numarası 
TK7874
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003521716
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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9. 
Digital transformation with AI and smart servicing technologies for sustainable rural development için kapak resmi
Digital transformation with AI and smart servicing technologies for sustainable rural development
Yazar 
Qin, Shengfeng, editor. Wang, Hongan, editor. Ma, Cuixia, editor.
Yer Numarası 
GE45 .D37 .D54 2024 EB
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781032686691
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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10. 
TRANSITION TO ADVANCED ANALYTICS get a return on your analytics investment. için kapak resmi
TRANSITION TO ADVANCED ANALYTICS get a return on your analytics investment.
Yazar 
Tan, Jason. Ferris, Brian.
Yer Numarası 
QA76.9 .Q36
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003408222
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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11. 
Quantum artificial intelligence with Qiskit. için kapak resmi
Quantum artificial intelligence with Qiskit.
Yazar 
Wichert, Andrzej, author.
Yer Numarası 
Q335
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003374404
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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12. 
Multidisciplinary Approaches for Sustainable Development için kapak resmi
Multidisciplinary Approaches for Sustainable Development
Yazar 
International Conference on Multidisciplinary Approaches for Sustainable Development in Science & Technology (1st : 2004 : Jaipur, India), sponsoring body. Tripathi, Anshuman, editor.
Yer Numarası 
HC79 .E5
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003543633
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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