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405 sonuç bulundu Arama sonuçlarına abone ol
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1. 
Cooperative Design, Visualization, and Engineering 21st International Conference, CDVE 2024, Valencia, Spain, September 15-18, 2024, Proceedings için kapak resmi
Cooperative Design, Visualization, and Engineering 21st International Conference, CDVE 2024, Valencia, Spain, September 15-18, 2024, Proceedings
Yazar 
Luo, Yuhua. editor. (orcid)0000-0003-3057-4753 SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-71315-6
Format: 
Durum 
Çevrimiçi Kütüphane~1
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2. 
Tools for Design, Implementation and Verification of Emerging Information Technologies 18th EAI International Conference, TRIDENTCOM 2023, Nanjing, China, November 11-13, 2023, Proceedings için kapak resmi
Tools for Design, Implementation and Verification of Emerging Information Technologies 18th EAI International Conference, TRIDENTCOM 2023, Nanjing, China, November 11-13, 2023, Proceedings
Yazar 
Liu, Jianghua. editor. Xu, Lei. editor. (orcid)0000-0001-9178-6640 Huang, Xinyi. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-51399-2
Format: 
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3. 
Constructive Side-Channel Analysis and Secure Design 15th International Workshop, COSADE 2024, Gardanne, France, April 9-10, 2024, Proceedings için kapak resmi
Constructive Side-Channel Analysis and Secure Design 15th International Workshop, COSADE 2024, Gardanne, France, April 9-10, 2024, Proceedings
Yazar 
Wacquez, Romain. author. Homma, Naofumi. editor. (orcid)0000-0003-0864-3126 SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-57543-3
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4. 
MAC Protocol Design in Full-Duplex Enabled Wireless Networks için kapak resmi
MAC Protocol Design in Full-Duplex Enabled Wireless Networks
Yazar 
Fu, Liqun. author. Liu, Shengbo. author. Wu, Wen. author. Zhang, Ning. author. Zhuang, Weihua. author.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-57296-8
Format: 
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5. 
Design, User Experience, and Usability 13th International Conference, DUXU 2024, Held as Part of the 26th HCI International Conference, HCII 2024, Washington, DC, USA, June 29 - July 4, 2024, Proceedings, Part V için kapak resmi
Design, User Experience, and Usability 13th International Conference, DUXU 2024, Held as Part of the 26th HCI International Conference, HCII 2024, Washington, DC, USA, June 29 - July 4, 2024, Proceedings, Part V
Yazar 
Marcus, Aaron. editor. Rosenzweig, Elizabeth. editor. Soares, Marcelo M. editor. (orcid)0000-0003-2942-5320 SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-61362-3
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6. 
Design, User Experience, and Usability 13th International Conference, DUXU 2024, Held as Part of the 26th HCI International Conference, HCII 2024, Washington, DC, USA, June 29 - July 4, 2024, Proceedings, Part IV için kapak resmi
Design, User Experience, and Usability 13th International Conference, DUXU 2024, Held as Part of the 26th HCI International Conference, HCII 2024, Washington, DC, USA, June 29 - July 4, 2024, Proceedings, Part IV
Yazar 
Marcus, Aaron. editor. Rosenzweig, Elizabeth. editor. Soares, Marcelo M. editor. (orcid)0000-0003-2942-5320 SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-61359-3
Format: 
Durum 
Çevrimiçi Kütüphane~1
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7. 
Design, User Experience, and Usability 13th International Conference, DUXU 2024, Held as Part of the 26th HCI International Conference, HCII 2024, Washington, DC, USA, June 29-July 4, 2024, Proceedings, Part II için kapak resmi
Design, User Experience, and Usability 13th International Conference, DUXU 2024, Held as Part of the 26th HCI International Conference, HCII 2024, Washington, DC, USA, June 29-July 4, 2024, Proceedings, Part II
Yazar 
Marcus, Aaron. editor. Rosenzweig, Elizabeth. editor. Soares, Marcelo M. editor. (orcid)0000-0003-2942-5320 SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-61353-1
Format: 
Durum 
Çevrimiçi Kütüphane~1
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8. 
Universal Access in Human-Computer Interaction. Design and Development Approaches and Methods 11th International Conference, UAHCI 2017, Held as Part of HCI International 2017, Vancouver, BC, Canada, July 9-14, 2017, Proceedings, Part I için kapak resmi
Universal Access in Human-Computer Interaction. Design and Development Approaches and Methods 11th International Conference, UAHCI 2017, Held as Part of HCI International 2017, Vancouver, BC, Canada, July 9-14, 2017, Proceedings, Part I
Yazar 
Antona, Margherita. editor. Stephanidis, Constantine. editor. (orcid)0000-0003-3687-4220 SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-58706-6
Format: 
Durum 
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9. 
Researching Complex Information Infrastructures Design Characteristics of ICT Tools for Examining Modern Technology Usage için kapak resmi
Researching Complex Information Infrastructures Design Characteristics of ICT Tools for Examining Modern Technology Usage
Yazar 
Ludwig, Thomas. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-658-16921-3
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10. 
Security-Aware Design for Cyber-Physical Systems A Platform-Based Approach için kapak resmi
Security-Aware Design for Cyber-Physical Systems A Platform-Based Approach
Yazar 
Lin, Chung-Wei. author. Sangiovanni-Vincentelli, Alberto. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-51328-7
Format: 
Durum 
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11. 
VLSI Design and Test 21st International Symposium, VDAT 2017, Roorkee, India, June 29 - July 2, 2017, Revised Selected Papers için kapak resmi
VLSI Design and Test 21st International Symposium, VDAT 2017, Roorkee, India, June 29 - July 2, 2017, Revised Selected Papers
Yazar 
Kaushik, Brajesh Kumar. editor. Dasgupta, Sudeb. editor. Singh, Virendra. editor. (orcid)0000-0002-9113-5167 SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-10-7470-7
Format: 
Durum 
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12. 
VLSI-SoC: System-on-Chip in the Nanoscale Era - Design, Verification and Reliability 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, Tallinn, Estonia, September 26-28, 2016, Revised Selected Papers için kapak resmi
VLSI-SoC: System-on-Chip in the Nanoscale Era - Design, Verification and Reliability 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, Tallinn, Estonia, September 26-28, 2016, Revised Selected Papers
Yazar 
Hollstein, Thomas. editor. Raik, Jaan. editor. Kostin, Sergei. editor. Tšertov, Anton. editor. O'Connor, Ian. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-67104-8
Format: 
Durum 
Çevrimiçi Kütüphane~1
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