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(6)
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(6)
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183 sonuç bulundu Arama sonuçlarına abone ol
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1. 
Artificial Intelligence and Soft Computing 22nd International Conference, ICAISC 2023, Zakopane, Poland, June 18-22, 2023, Proceedings, Part I için kapak resmi
Artificial Intelligence and Soft Computing 22nd International Conference, ICAISC 2023, Zakopane, Poland, June 18-22, 2023, Proceedings, Part I
Yazar 
Rutkowski, Leszek. editor. Scherer, Rafał. editor. Korytkowski, Marcin. editor. Pedrycz, Witold. editor. Tadeusiewicz, Ryszard. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-42505-9
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2. 
Artificial Intelligence XL 43rd SGAI International Conference on Artificial Intelligence, AI 2023, Cambridge, UK, December 12-14, 2023, Proceedings için kapak resmi
Artificial Intelligence XL 43rd SGAI International Conference on Artificial Intelligence, AI 2023, Cambridge, UK, December 12-14, 2023, Proceedings
Yazar 
Bramer, Max. editor. Stahl, Frederic. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-47994-6
Format: 
Durum 
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3. 
Neural Information Processing 29th International Conference, ICONIP 2022, Virtual Event, November 22-26, 2022, Proceedings, Part IV için kapak resmi
Neural Information Processing 29th International Conference, ICONIP 2022, Virtual Event, November 22-26, 2022, Proceedings, Part IV
Yazar 
Tanveer, Mohammad. editor. Agarwal, Sonali. editor. Ozawa, Seiichi. editor. Ekbal, Asif. editor. Jatowt, Adam. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-99-1639-9
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4. 
Machine Intelligence and Emerging Technologies First International Conference, MIET 2022, Noakhali, Bangladesh, September 23-25, 2022, Proceedings, Part II için kapak resmi
Machine Intelligence and Emerging Technologies First International Conference, MIET 2022, Noakhali, Bangladesh, September 23-25, 2022, Proceedings, Part II
Yazar 
Satu, Md. Shahriare. editor. (orcid) Moni, Mohammad Ali. editor. Kaiser, M. Shamim. editor. Arefin, Mohammad Shamsul. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-34622-4
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5. 
Cooperative and Distributed Intelligent Computation in Fog Computing Concepts, Architectures, and Frameworks için kapak resmi
Cooperative and Distributed Intelligent Computation in Fog Computing Concepts, Architectures, and Frameworks
Yazar 
Tran-Dang, Hoa. author. Kim, Dong-Seong. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-33920-2
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6. 
Sentiment Analysis in the Medical Domain için kapak resmi
Sentiment Analysis in the Medical Domain
Yazar 
Denecke, Kerstin. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-30187-2
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7. 
Smart Cities, Green Technologies, and Intelligent Transport Systems 11th International Conference, SMARTGREENS 2022, and 8th International Conference, VEHITS 2022, Virtual Event, April 27-29, 2022, Revised Selected Papers için kapak resmi
Smart Cities, Green Technologies, and Intelligent Transport Systems 11th International Conference, SMARTGREENS 2022, and 8th International Conference, VEHITS 2022, Virtual Event, April 27-29, 2022, Revised Selected Papers
Yazar 
Klein, Cornel. editor. Jarke, Matthias. editor. Ploeg, Jeroen. editor. Helfert, Markus. editor. Berns, Karsten. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-37470-8
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8. 
Pan-African Artificial Intelligence and Smart Systems Second EAI International Conference, PAAISS 2022, Dakar, Senegal, November 2-4, 2022, Proceedings için kapak resmi
Pan-African Artificial Intelligence and Smart Systems Second EAI International Conference, PAAISS 2022, Dakar, Senegal, November 2-4, 2022, Proceedings
Yazar 
Ngatched Nkouatchah, Telex Magloire. editor. Woungang, Isaac. editor. Tapamo, Jules-Raymond. editor. Viriri, Serestina. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-25271-6
Format: 
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9. 
Towards AI-Aided Invention and Innovation 23rd International TRIZ Future Conference, TFC 2023, Offenburg, Germany, September 12-14, 2023, Proceedings için kapak resmi
Towards AI-Aided Invention and Innovation 23rd International TRIZ Future Conference, TFC 2023, Offenburg, Germany, September 12-14, 2023, Proceedings
Yazar 
Cavallucci, Denis. editor. Livotov, Pavel. editor. Brad, Stelian. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-42532-5
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10. 
Advanced Network Technologies and Intelligent Computing Second International Conference, ANTIC 2022, Varanasi, India, December 22-24, 2022, Proceedings, Part II için kapak resmi
Advanced Network Technologies and Intelligent Computing Second International Conference, ANTIC 2022, Varanasi, India, December 22-24, 2022, Proceedings, Part II
Yazar 
Woungang, Isaac. editor. Dhurandher, Sanjay Kumar. editor. Pattanaik, Kiran Kumar. editor. Verma, Anshul. editor. Verma, Pradeepika. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-28183-9
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11. 
Computer Science and Education in Computer Science 19th EAI International Conference, CSECS 2023, Boston, MA, USA, June 28-29, 2023, Proceedings için kapak resmi
Computer Science and Education in Computer Science 19th EAI International Conference, CSECS 2023, Boston, MA, USA, June 28-29, 2023, Proceedings
Yazar 
Zlateva, Tanya. editor. Tuparov, Georgi. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-44668-9
Format: 
Durum 
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12. 
Intelligent Transport Systems 6th EAI International Conference, INTSYS 2022, Lisbon, Portugal, December 15-16, 2022, Proceedings için kapak resmi
Intelligent Transport Systems 6th EAI International Conference, INTSYS 2022, Lisbon, Portugal, December 15-16, 2022, Proceedings
Yazar 
Martins, Ana Lucia. editor. (orcid) Ferreira, Joao C. editor. Kocian, Alexander. editor. Tokkozhina, Ulpan. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-30855-0
Format: 
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