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Yazar

Jaeger, Richard C.

(5)

Wiley InterScience (Online service)

(4)

Blalock, Travis N.

(3)

Brown, William D., 1943-

(3)

SpringerLink (Online service)

(3)

Brewer, Joe (Joe E.)

(2)

IEEE Circuits and Systems Society.

(2)

IEEE Solid-State Circuits Society.

(2)

Ulrich, Richard K. (Richard Kevin), 1955-

(2)

?saka, Tetsuya, 1945-

(1)

Ahsan, Tanweer, editor.

(1)

American Chemical Society. Division of Polymeric Materials: Science and Engineering.

(1)

Andreou, Andreas G.

(1)

Baker, R. Jacob, 1964-

(1)

Ballantyne, J. P.

(1)

Bhushan, Manjul. author.

(1)

Blalock, Travis N., ort. yaz.

(1)

Brand, Oliver. author.

(1)

Brewer, George Raymond, 1922-

(1)

Cheeke, J. David N.

(1)

(1)

Chen, Jing, 1974-

(1)

Choudhary, Vikas.

(1)

Components, Packaging & Manufacturing Technology Society.

(1)

(1)

Elst, Günter. editor.

(1)

Fleetwood, Daniel.

(1)

(1)

(1)

Gutmann, Ronald J.

(1)

Hanke, Randolf. editor.

(1)

Heuberger, Albert. editor.

(1)

Horie, Kazuyuki, 1941-

(1)

Iniewski, Krzysztof.

(1)

Ito, Hiroshi, ed.

(1)

Jim�enez, J. (Juan)

(1)

(1)

John Wiley & Sons.

(1)

Karimi-Ghartemani, Masoud, author.

(1)

Kaya, İbrahim.

(1)

Ketchen, Mark B. author.

(1)

(1)

Kåobunshi Gakkai (Japan). Polymers for Microelectronics and Photonics Group.

(1)

(1)

Liu, S. (Sheng), 1963-

(1)

(1)

Liu, Yong, 1962-

(1)

(1)

(1)

Makabe, T. (Toshiaki)

(1)

Makabe, T. (Toshiaki), author.

(1)

Marcus, P. (Philippe), 1953-

(1)

Mayer, Michael. author.

(1)

Mittal, K. L., 1945- editor.

(1)

(1)

Oklobdzija, Vojin G.

(1)

Pantelides, Sokrates T.

(1)

Pecht, Michael.

(1)

Pereira, Oswyn.

(1)

(1)

Petrovi¿̐ưc, Z., author.

(1)

Puttlitz, Karl J.

(1)

Ramaswami, Sesh.

(1)

(1)

Rossnagel, Stephen M.

(1)

Ruska, W. Scot.

(1)

Schrimpf, Ronald Donald.

(1)

Schultze, J. W. (Joachim Walter)

(1)

Schwizer, Jürg. author.

(1)

Sedra, Adel S., author.

(1)

(1)

Smith, Kenneth C. (Kenneth Carless), author.

(1)

Stalter, Kathleen A.

(1)

Steigerwald, Joseph M.

(1)

Strong, Alvin Wayne, 1946-

(1)

Suganuma, Katsuaki, editor.

(1)

Sánchez-Sinencio, Edgar.

(1)

Tagawa, Seichi, ed.

(1)

(1)

Wang, Zhiping, 1962- Oct. 6-

(1)

Waynant, Ronald W.

(1)

(1)

(1)

Yang, Edward S.

(1)

Özerdem, Mehmet Siraç, çeviri editörü

(1)

Tümünü genişlet

Dil

(36)

(2)

Yayın Yılı

-

(8)

(4)

(3)

(3)

(3)

(2)

(2)

(2)

(2)

(2)

(2)

(2)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

Tümünü genişlet

Konu

Microelectronic packaging.

(11)

Electronic books.

(9)

Integrated circuits -- Design and construction.

(6)

Semiconductors -- Design and construction.

(5)

Electronic circuit design.

(3)

Microelectronics.

(3)

Mikroelektronik.

(3)

Chemical mechanical planarization.

(2)

Electronic circuits.

(2)

Electronic packaging.

(2)

(2)

Low voltage integrated circuits.

(2)

Microelectromechanical systems.

(2)

Microelectronics -- Materials.

(2)

MİKROELEKTRONİK.

(2)

Optical materials.

(2)

Optoelectronic devices.

(2)

Plasma engineering.

(2)

Systems engineering.

(2)

İNTEGRE DEVRELER -- ÇİZİM VE YAPIM.

(2)

Adhesive joints.

(1)

(1)

Appareil électronique.

(1)

CMOS (Circuit intégré)

(1)

CMOS-Schaltung.

(1)

(1)

Chip scale packaging.

(1)

Circuit intégré à faible consommation.

(1)

Circuit intégré à très grande échelle.

(1)

Circuit logique.

(1)

Circuit électronique.

(1)

Computer network architectures.

(1)

Computer science.

(1)

Corrosion and anti-corrosives.

(1)

Dispositif optoélectronique.

(1)

Electric connectors.

(1)

Electric power systems -- Equipment and supplies.

(1)

Electronic apparatus and appliances -- Design and construction.

(1)

Electronic apparatus and appliances.

(1)

Elektronenstrahllithographie.

(1)

Elektronik devreler.

(1)

(1)

Environmental protection.

(1)

(1)

Flash memories (Computers)

(1)

Frequency synthesizers.

(1)

Green products.

(1)

Grinding and polishing.

(1)

High performance processors -- Design and construction.

(1)

High power lasers.

(1)

ISI -- İLETİM.

(1)

Integrated circuits -- Defects.

(1)

Integrated circuits -- Very large scale integration -- Design and construction -- Textbooks.

(1)

Integrated circuits industry.

(1)

Lithography, Electron beam.

(1)

Logic circuits.

(1)

MIKROELEKTRONIK.

(1)

Metal oxide semiconductor field-effect transistors -- Testing.

(1)

Metal oxide semiconductor field-effect transistors.

(1)

Metal oxide semiconductors, Complementary -- Design and construction.

(1)

Metal oxide semiconductors, Complementary -- Reliability.

(1)

Metal oxide semiconductors, Complementary.

(1)

Microelectronic packaging -- Materials.

(1)

Microelectronic packaging -- Simulation methods.

(1)

Microelectronic.

(1)

Microelectronics -- Materials -- Congresses.

(1)

Microelectronics -- Materials -- Testing.

(1)

Microprogramming.

(1)

Mikroelektronik -- Maddele -- Kongreler.

(1)

Mise sous boîtier (Microélectronique)

(1)

Mise sous boîtier (Électronique)

(1)

Multichip modules (Microelectronics)

(1)

Mémoire à semiconducteurs.

(1)

(1)

Nanostructured materials.

(1)

Nanotechnology.

(1)

Passive components.

(1)

Phase-locked loops.

(1)

Photoluminescence.

(1)

(1)

Polymers -- Congresses.

(1)

Power electronics.

(1)

Printed circuits -- Equipment and supplies.

(1)

(1)

Schaltungsentwurf.

(1)

Semiconductor lasers.

(1)

Semiconductor storage devices.

(1)

Software engineering.

(1)

Solder and soldering.

(1)

Strains and stresses -- Measurement.

(1)

(1)

TECHNOLOGY & ENGINEERING -- Electronics -- Digital.

(1)

TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.

(1)

TECHNOLOGY & ENGINEERING / Microwaves

(1)

Thin films -- Computer simulation -- Congresses.

(1)

Three-dimensional integrated circuits -- Computer-aided design.

(1)

Three-dimensional integrated circuits -- Design and construction.

(1)

Three-dimensional integrated circuits -- Testing.

(1)

Three-dimensional integrated circuits.

(1)

Timing circuits.

(1)

Ultrasonic waves -- Industrial applications.

(1)

Ultrasonic waves.

(1)

Very high speed integrated circuits.

(1)

Wide gap semiconductors.

(1)

YARIİLETKENLER -- ÇİZİM VE YAPIM.

(1)

YARIİLETKENLER.

(1)

Tümünü genişlet

Materyal Türü

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37.

Adhesion in microelectronics için kapak resmi

Adhesion in microelectronics

Adhesion in microelectronics

Yazar

Mittal, K. L., 1945- editor. Ahsan, Tanweer, editor.

Yer Numarası

ONLINE(341844.1)

Elektronik Erişim

ebrary An electronic book accessible through the World Wide Web; click to view
Ebook Library http://public.eblib.com/choice/PublicFullRecord.aspx?p=1767917
John Wiley http://dx.doi.org/10.1002/9781118831373

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38.

MEMS fundamental technology and applications için kapak resmi

MEMS fundamental technology and applications

MEMS fundamental technology and applications

Yazar

Choudhary, Vikas. Iniewski, Krzysztof.

Yer Numarası

ONLINE

Elektronik Erişim

Distributed by publisher. Purchase or institutional license may be required for access.

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39.

Corrosion mechanisms in theory and practice için kapak resmi

Corrosion mechanisms in theory and practice

Corrosion mechanisms in theory and practice

Yazar

Marcus, P. (Philippe), 1953-

Yer Numarası

ONLINE

Elektronik Erişim

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40.

Semiconductor packaging materials interaction and reliability için kapak resmi

Semiconductor packaging materials interaction and reliability

Semiconductor packaging materials interaction and reliability

Yazar

Chen, Andrea. Lo, Randy.

Yer Numarası

ONLINE

Elektronik Erişim

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41.

Fundamentals and applications of ultrasonic waves için kapak resmi

Fundamentals and applications of ultrasonic waves

Fundamentals and applications of ultrasonic waves

Yazar

Cheeke, J. David N.

Yer Numarası

ONLINE

Elektronik Erişim

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42.

3D IC stacking technology için kapak resmi

3D IC stacking technology

3D IC stacking technology

Yazar

Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.

Yer Numarası

ONLINE

Elektronik Erişim

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43.

Quantum-well laser array packaging nanoscale packaging techniques için kapak resmi

Quantum-well laser array packaging nanoscale packaging techniques

Quantum-well laser array packaging nanoscale packaging techniques

Yazar

Tomm, Jens W. Jim�enez, J. (Juan)

Yer Numarası

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Elektronik Erişim

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44.

Introduction to microsystem packaging technology için kapak resmi

Introduction to microsystem packaging technology

Introduction to microsystem packaging technology

Yazar

Jin, Yufeng. Wang, Zhiping, 1962- Oct. 6- Chen, Jing, 1974-

Yer Numarası

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Elektronik Erişim

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45.

MEMS/MOEMS packaging concepts, designs, materials, and processes için kapak resmi

MEMS/MOEMS packaging concepts, designs, materials, and processes

MEMS/MOEMS packaging concepts, designs, materials, and processes

Yazar

Gilleo, Ken.

Yer Numarası

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Elektronik Erişim

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46.

Advanced electronic packaging için kapak resmi

Advanced electronic packaging

Advanced electronic packaging

Yazar

Brown, William D., 1943- Ulrich, Richard K. (Richard Kevin), 1955-

Yer Numarası

ONLINE

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47.

IC component sockets için kapak resmi

IC component sockets

IC component sockets

Yazar

Liu, Weifeng. Pecht, Michael. John Wiley & Sons.

Yer Numarası

ONLINE

Elektronik Erişim

John Wiley http://dx.doi.org/10.1002/0471648272
Contributor biographical information http://catdir.loc.gov/catdir/bios/wiley046/2004043361.html

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