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390 sonuç bulundu Arama sonuçlarına abone ol
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1. 
Software Architecture. ECSA 2022 Tracks and Workshops Prague, Czech Republic, September 19-23, 2022, Revised Selected Papers için kapak resmi
Software Architecture. ECSA 2022 Tracks and Workshops Prague, Czech Republic, September 19-23, 2022, Revised Selected Papers
Yazar 
Batista, Thais. editor. Bureš, Tomáš. editor. Raibulet, Claudia. editor. Muccini, Henry. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-36889-9
Format: 
Durum 
Çevrimiçi Kütüphane~1
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2. 
Web Information Systems Engineering - WISE 2023 24th International Conference, Melbourne, VIC, Australia, October 25-27, 2023, Proceedings için kapak resmi
Web Information Systems Engineering - WISE 2023 24th International Conference, Melbourne, VIC, Australia, October 25-27, 2023, Proceedings
Yazar 
Zhang, Feng. editor. Wang, Hua. editor. Barhamgi, Mahmoud. editor. Chen, Lu. editor. Zhou, Rui. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-99-7254-8
Format: 
Durum 
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3. 
Intelligent Data Engineering and Automated Learning - IDEAL 2023 24th International Conference, Évora, Portugal, November 22-24, 2023, Proceedings için kapak resmi
Intelligent Data Engineering and Automated Learning - IDEAL 2023 24th International Conference, Évora, Portugal, November 22-24, 2023, Proceedings
Yazar 
Quaresma, Paulo. editor. Camacho, David. editor. (orcid) Yin, Hujun. editor. (orcid) Gonçalves, Teresa. editor. Julian, Vicente. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-48232-8
Format: 
Durum 
Çevrimiçi Kütüphane~1
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4. 
Emerging Trends in Expert Applications and Security Proceedings of 2nd ICETEAS 2023, Volume 2 için kapak resmi
Emerging Trends in Expert Applications and Security Proceedings of 2nd ICETEAS 2023, Volume 2
Yazar 
Rathore, Vijay Singh. editor. Piuri, Vincenzo. editor. Babo, Rosalina. editor. Ferreira, Marta Campos. editor. (orcid)0000-0001-9505-5730 SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-99-1946-8
Format: 
Durum 
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5. 
ICT Systems and Sustainability Proceedings of ICT4SD 2023, Volume 1 için kapak resmi
ICT Systems and Sustainability Proceedings of ICT4SD 2023, Volume 1
Yazar 
Tuba, Milan. editor. Akashe, Shyam. editor. Joshi, Amit. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-99-5652-4
Format: 
Durum 
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6. 
Machine Learning and Metaheuristics: Methods and Analysis için kapak resmi
Machine Learning and Metaheuristics: Methods and Analysis
Yazar 
Dulhare, Uma N. editor. Houssein, Essam Halim. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-99-6645-5
Format: 
Durum 
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7. 
Signed Language and Gesture Research in Cognitive Linguistics için kapak resmi
Signed Language and Gesture Research in Cognitive Linguistics
Yazar 
Braem, Penny Boyes, contributor. Engberg-Pedersen, Elisabeth, contributor. Garcia, Brigitte, contributor. Hou, Lynn, contributor. Janzen, Terry, contributor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1515/9783110703788
https://www.degruyter.com/isbn/9783110703788
Cover https://www.degruyter.com/document/cover/isbn/9783110703788/original
Format: 
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8. 
Language Learning and Leisure : Informal Language Learning in the Digital Age için kapak resmi
Language Learning and Leisure : Informal Language Learning in the Digital Age
Yazar 
Alm, Antonie, contributor. Arndt, Henriette L., contributor. Benson, Phil, contributor. Cajka, Stefanie, contributor. Dressman, Mark, contributor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1515/9783110752441
https://www.degruyter.com/isbn/9783110752441
Cover https://www.degruyter.com/document/cover/isbn/9783110752441/original
Format: 
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9. 
Multi-disciplinary Trends in Artificial Intelligence 16th International Conference, MIWAI 2023, Hyderabad, India, July 21-22, 2023, Proceedings için kapak resmi
Multi-disciplinary Trends in Artificial Intelligence 16th International Conference, MIWAI 2023, Hyderabad, India, July 21-22, 2023, Proceedings
Yazar 
Morusupalli, Raghava. editor. Dandibhotla, Teja Santosh. editor. Atluri, Vani Vathsala. editor. Windridge, David. editor. Lingras, Pawan. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-36402-0
Format: 
Durum 
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10. 
Computational Science and Its Applications - ICCSA 2023 Workshops Athens, Greece, July 3-6, 2023, Proceedings, Part IV için kapak resmi
Computational Science and Its Applications - ICCSA 2023 Workshops Athens, Greece, July 3-6, 2023, Proceedings, Part IV
Yazar 
Gervasi, Osvaldo. editor. (orcid) Murgante, Beniamino. editor. (orcid) Rocha, Ana Maria A. C. editor. (orcid) Garau, Chiara. editor. (orcid) Scorza, Francesco. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-37114-1
Format: 
Durum 
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11. 
Computational Science and Its Applications - ICCSA 2023 23rd International Conference, Athens, Greece, July 3-6, 2023, Proceedings, Part II için kapak resmi
Computational Science and Its Applications - ICCSA 2023 23rd International Conference, Athens, Greece, July 3-6, 2023, Proceedings, Part II
Yazar 
Gervasi, Osvaldo. editor. (orcid) Murgante, Beniamino. editor. (orcid) Taniar, David. editor. Apduhan, Bernady O. editor. Braga, Ana Cristina. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-36808-0
Format: 
Durum 
Çevrimiçi Kütüphane~1
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12. 
Human Interface and the Management of Information Thematic Area, HIMI 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part II için kapak resmi
Human Interface and the Management of Information Thematic Area, HIMI 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part II
Yazar 
Mori, Hirohiko. editor. Asahi, Yumi. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-35129-7
Format: 
Durum 
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