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185 sonuç bulundu Arama sonuçlarına abone ol
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1. 
Advanced Network Technologies and Intelligent Computing Second International Conference, ANTIC 2022, Varanasi, India, December 22-24, 2022, Proceedings, Part I için kapak resmi
Advanced Network Technologies and Intelligent Computing Second International Conference, ANTIC 2022, Varanasi, India, December 22-24, 2022, Proceedings, Part I
Yazar 
Woungang, Isaac. editor. Dhurandher, Sanjay Kumar. editor. Pattanaik, Kiran Kumar. editor. Verma, Anshul. editor. Verma, Pradeepika. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-28180-8
Format: 
Durum 
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2. 
E-Business and Telecommunications 18th International Conference, ICETE 2021, Virtual Event, July 6-9, 2021, Revised Selected Papers için kapak resmi
E-Business and Telecommunications 18th International Conference, ICETE 2021, Virtual Event, July 6-9, 2021, Revised Selected Papers
Yazar 
Samarati, Pierangela. editor. van Sinderen, Marten. editor. Vimercati, Sabrina De Capitani di. editor. Wijnhoven, Fons. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-36840-0
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3. 
Combinatorial Algorithms 34th International Workshop, IWOCA 2023, Tainan, Taiwan, June 7-10, 2023, Proceedings için kapak resmi
Combinatorial Algorithms 34th International Workshop, IWOCA 2023, Tainan, Taiwan, June 7-10, 2023, Proceedings
Yazar 
Hsieh, Sun-Yuan. editor. Hung, Ling-Ju. editor. Lee, Chia-Wei. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-34347-6
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4. 
Music in the AI Era 15th International Symposium, CMMR 2021, Virtual Event, November 15-19, 2021, Revised Selected Papers için kapak resmi
Music in the AI Era 15th International Symposium, CMMR 2021, Virtual Event, November 15-19, 2021, Revised Selected Papers
Yazar 
Aramaki, Mitsuko. editor. Hirata, Keiji. editor. Kitahara, Tetsuro. editor. Kronland-Martinet, Richard. editor. Ystad, Sølvi. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-35382-6
Format: 
Durum 
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5. 
HCI in Business, Government and Organizations 10th International Conference, HCIBGO 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part I için kapak resmi
HCI in Business, Government and Organizations 10th International Conference, HCIBGO 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part I
Yazar 
Nah, Fiona. editor. Siau, Keng. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-35969-9
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6. 
HCI in Business, Government and Organizations 10th International Conference, HCIBGO 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part II için kapak resmi
HCI in Business, Government and Organizations 10th International Conference, HCIBGO 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part II
Yazar 
Nah, Fiona. editor. Siau, Keng. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-36049-7
Format: 
Durum 
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7. 
Business Process Management 21st International Conference, BPM 2023, Utrecht, The Netherlands, September 11-15, 2023, Proceedings için kapak resmi
Business Process Management 21st International Conference, BPM 2023, Utrecht, The Netherlands, September 11-15, 2023, Proceedings
Yazar 
Di Francescomarino, Chiara. editor. Burattin, Andrea. editor. Janiesch, Christian. editor. Sadiq, Shazia. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-41620-0
Format: 
Durum 
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8. 
Image and Graphics 12th International Conference, ICIG 2023, Nanjing, China, September 22-24, 2023, Proceedings, Part I için kapak resmi
Image and Graphics 12th International Conference, ICIG 2023, Nanjing, China, September 22-24, 2023, Proceedings, Part I
Yazar 
Lu, Huchuan. editor. Ouyang, Wanli. editor. Huang, Hui. editor. Lu, Jiwen. editor. Liu, Risheng. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-46305-1
Format: 
Durum 
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9. 
Progress in Artificial Intelligence 22nd EPIA Conference on Artificial Intelligence, EPIA 2023, Faial Island, Azores, September 5-8, 2023, Proceedings, Part II için kapak resmi
Progress in Artificial Intelligence 22nd EPIA Conference on Artificial Intelligence, EPIA 2023, Faial Island, Azores, September 5-8, 2023, Proceedings, Part II
Yazar 
Moniz, Nuno. editor. Vale, Zita. editor. Cascalho, José. editor. Silva, Catarina. editor. Sebastião, Raquel. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-49011-8
Format: 
Durum 
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10. 
Chinese People's Time Use and Their Quality of Life Research Report of Chinese Time Use Survey için kapak resmi
Chinese People's Time Use and Their Quality of Life Research Report of Chinese Time Use Survey
Yazar 
Du, Fenglian. author. Wang, Wenbin. author. Dong, Xiaoyuan. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-99-5526-8
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11. 
Maize Improvement Current Advances in Yield, Quality, and Stress Tolerance under Changing Climatic Scenarios için kapak resmi
Maize Improvement Current Advances in Yield, Quality, and Stress Tolerance under Changing Climatic Scenarios
Yazar 
Wani, Shabir Hussain. editor. Dar, Zahoor Ahmad. editor. Singh, Gyanendra Pratap. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-21640-4
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12. 
Role of Data-Intensive Distributed Computing Systems in Designing Data Solutions için kapak resmi
Role of Data-Intensive Distributed Computing Systems in Designing Data Solutions
Yazar 
Pandey, Sarvesh. editor. Shanker, Udai. editor. Saravanan, Vijayalakshmi. editor. Ramalingam, Rajinikumar. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-15542-0
Format: 
Durum 
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