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Project Muse.
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49. 
The humanitarian parent : balancing work and family in the aid sector için kapak resmi
The humanitarian parent : balancing work and family in the aid sector
Yazar 
Hietanen, Merit, author.
Yer Numarası 
HV553
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003301578
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format: 
Durum 
Çevrimiçi Kütüphane~1
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50. 
Migrant workers' narratives of return : alienation and identity transformations için kapak resmi
Migrant workers' narratives of return : alienation and identity transformations
Yazar 
Ladegaard, Hans J., author.
Yer Numarası 
HD8716.5
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003263005
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format: 
Durum 
Çevrimiçi Kütüphane~1
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Kopya:
51. 
Design in the Era of Industry 4.0, Volume 1 Proceedings of ICoRD 2023 için kapak resmi
Design in the Era of Industry 4.0, Volume 1 Proceedings of ICoRD 2023
Yazar 
Chakrabarti, Amaresh. editor. Singh, Vishal. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-99-0293-4
Format: 
Durum 
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52. 
Applied Technologies 4th International Conference, ICAT 2022, Quito, Ecuador, November 23-25, 2022, Revised Selected Papers, Part III için kapak resmi
Applied Technologies 4th International Conference, ICAT 2022, Quito, Ecuador, November 23-25, 2022, Revised Selected Papers, Part III
Yazar 
Botto-Tobar, Miguel. editor. (orcid) Zambrano Vizuete, Marcelo. editor. Montes León, Sergio. editor. Torres-Carrión, Pablo. editor. Durakovic, Benjamin. editor. (orcid)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-24978-5
Format: 
Durum 
Çevrimiçi Kütüphane~1
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Kopya:
53. 
Human Aspects of Information Security and Assurance 17th IFIP WG 11.12 International Symposium, HAISA 2023, Kent, UK, July 4-6, 2023, Proceedings için kapak resmi
Human Aspects of Information Security and Assurance 17th IFIP WG 11.12 International Symposium, HAISA 2023, Kent, UK, July 4-6, 2023, Proceedings
Yazar 
Furnell, Steven. editor. Clarke, Nathan. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-38530-8
Format: 
Durum 
Çevrimiçi Kütüphane~1
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54. 
Collaborative Networks in Digitalization and Society 5.0 24th IFIP WG 5.5 Working Conference on Virtual Enterprises, PRO-VE 2023, Valencia, Spain, September 27-29, 2023, Proceedings için kapak resmi
Collaborative Networks in Digitalization and Society 5.0 24th IFIP WG 5.5 Working Conference on Virtual Enterprises, PRO-VE 2023, Valencia, Spain, September 27-29, 2023, Proceedings
Yazar 
Camarinha-Matos, Luis M. editor. Boucher, Xavier. editor. Ortiz, Angel. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-42622-3
Format: 
Durum 
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55. 
After Latour: Globalisation, Inequity and Climate Change IFIP WG 8.2 and WG 9.4 Joint Working Conference, IFIPJWC 2023, Hyderabad, India, December 7-8, 2023, Proceedings için kapak resmi
After Latour: Globalisation, Inequity and Climate Change IFIP WG 8.2 and WG 9.4 Joint Working Conference, IFIPJWC 2023, Hyderabad, India, December 7-8, 2023, Proceedings
Yazar 
Jones, Matthew R. editor. Mukherjee, Arunima S. editor. Thapa, Devinder. editor. Zheng, Yingqin. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-50154-8
Format: 
Durum 
Çevrimiçi Kütüphane~1
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56. 
Distributed, Ambient and Pervasive Interactions 11th International Conference, DAPI 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part II için kapak resmi
Distributed, Ambient and Pervasive Interactions 11th International Conference, DAPI 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part II
Yazar 
Streitz, Norbert A. editor. Konomi, Shin'ichi. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-34609-5
Format: 
Durum 
Çevrimiçi Kütüphane~1
Rafta:
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57. 
Social, Cultural, and Behavioral Modeling 16th International Conference, SBP-BRiMS 2023, Pittsburgh, PA, USA, September 20-22, 2023, Proceedings için kapak resmi
Social, Cultural, and Behavioral Modeling 16th International Conference, SBP-BRiMS 2023, Pittsburgh, PA, USA, September 20-22, 2023, Proceedings
Yazar 
Thomson, Robert. editor. (orcid) Al-khateeb, Samer. editor. Burger, Annetta. editor. Park, Patrick. editor. A. Pyke, Aryn. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-43129-6
Format: 
Durum 
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58. 
Digital Transformation: What is the Impact on Workers Today? için kapak resmi
Digital Transformation: What is the Impact on Workers Today?
Yazar 
Dvořáková, Zuzana. editor. Kulachinskaya, Anastasia. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-47694-5
Format: 
Durum 
Çevrimiçi Kütüphane~1
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59. 
Big Data and Security 4th International Conference, ICBDS 2022, Xiamen, China, December 8-12, 2022, Proceedings için kapak resmi
Big Data and Security 4th International Conference, ICBDS 2022, Xiamen, China, December 8-12, 2022, Proceedings
Yazar 
Tian, Yuan. editor. (orcid) Ma, Tinghuai. editor. (orcid) Jiang, Qingshan. editor. Liu, Qi. editor. Khan, Muhammad Khurram. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-99-3300-6
Format: 
Durum 
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60. 
Women's work in the unorganised sector : issues of exploitation and globalisation in the beedi industry için kapak resmi
Women's work in the unorganised sector : issues of exploitation and globalisation in the beedi industry
Yazar 
Pande, Rekha, 1955- author.
Yer Numarası 
HD6073 .T62
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003317944
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format: 
Durum 
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