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1. 
International dictionary of abbreviations and acronyms of electronics, electrical engineering, computer technology, and information processing : Vol. 1: A - I. Vol. 2: J - Z için kapak resmi
International dictionary of abbreviations and acronyms of electronics, electrical engineering, computer technology, and information processing : Vol. 1: A - I. Vol. 2: J - Z
Yazar 
Wennrich, Peter, author.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1515/9783111670409
https://www.degruyter.com/isbn/9783111670409
Cover https://www.degruyter.com/document/cover/isbn/9783111670409/original
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2. 
Practically Speaking : A Dictionary of Quotations on Engineering, Technology and Architecture. için kapak resmi
Practically Speaking : A Dictionary of Quotations on Engineering, Technology and Architecture.
Yazar 
Gaither, Carl C., 1944- author.
Yer Numarası 
TA9
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9780429187155
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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3. 
Proceedings of the 3rd International Colloquium on Sports Science, Exercise, Engineering and Technology ICoSSEET 2016, 20-22 November 2016, Kota Kinabalu, Malaysia için kapak resmi
Proceedings of the 3rd International Colloquium on Sports Science, Exercise, Engineering and Technology ICoSSEET 2016, 20-22 November 2016, Kota Kinabalu, Malaysia
Yazar 
Sulaiman, Norasrudin. editor. Ismail, Shariman Ismadi. editor. Adnan, Rahmat. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-10-6772-3
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4. 
IRC-SET 2018 Proceedings of the 4th IRC Conference on Science, Engineering and Technology için kapak resmi
IRC-SET 2018 Proceedings of the 4th IRC Conference on Science, Engineering and Technology
Yazar 
Guo, Huaqun. editor. Ren, Hongliang. editor. Bandla, Aishwarya. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-32-9828-6
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5. 
Computer Engineering and Technology 23rd CCF Conference, NCCET 2019, Enshi, China, August 1–2, 2019, Revised Selected Papers için kapak resmi
Computer Engineering and Technology 23rd CCF Conference, NCCET 2019, Enshi, China, August 1–2, 2019, Revised Selected Papers
Yazar 
Xu, Weixia. editor. Xiao, Liquan. editor. Li, Jinwen. editor. Zhu, Zhenzhen. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-15-1850-8
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6. 
Asset Intelligence through Integration and Interoperability and Contemporary Vibration Engineering Technologies Proceedings of the 12th World Congress on Engineering Asset Management and the 13th International Conference on Vibration Engineering and Technology of Machinery için kapak resmi
Asset Intelligence through Integration and Interoperability and Contemporary Vibration Engineering Technologies Proceedings of the 12th World Congress on Engineering Asset Management and the 13th International Conference on Vibration Engineering and Technology of Machinery
Yazar 
Mathew, Joseph. editor. Lim, C.W. editor. Ma, Lin. editor. Sands, Don. editor. Cholette, Michael E. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-95711-1
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7. 
Proceedings of the 2nd International Conference on Data Engineering and Communication Technology ICDECT 2017 için kapak resmi
Proceedings of the 2nd International Conference on Data Engineering and Communication Technology ICDECT 2017
Yazar 
Kulkarni, Anand J. editor. Satapathy, Suresh Chandra. editor. Kang, Tai. editor. Kashan, Ali Husseinzadeh. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-13-1610-4
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8. 
Industry Interactive Innovations in Science, Engineering and Technology Proceedings of the International Conference, I3SET 2016 için kapak resmi
Industry Interactive Innovations in Science, Engineering and Technology Proceedings of the International Conference, I3SET 2016
Yazar 
Bhattacharyya, Swapan. editor. Sen, Sabyasachi. editor. Dutta, Meghamala. editor. Biswas, Papun. editor. Chattopadhyay, Himadri. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-10-3953-9
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9. 
Recent Trends and Future Technology in Applied Intelligence 31st International Conference on Industrial Engineering and Other Applications of Applied Intelligent Systems, IEA/AIE 2018, Montreal, QC, Canada, June 25-28, 2018, Proceedings için kapak resmi
Recent Trends and Future Technology in Applied Intelligence 31st International Conference on Industrial Engineering and Other Applications of Applied Intelligent Systems, IEA/AIE 2018, Montreal, QC, Canada, June 25-28, 2018, Proceedings
Yazar 
Mouhoub, Malek. editor. Sadaoui, Samira. editor. Ait Mohamed, Otmane. editor. Ali, Moonis. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-92058-0
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10. 
Computer Engineering and Technology 21st CCF Conference, NCCET 2017, Xiamen, China, August 16–18, 2017, Revised Selected Papers için kapak resmi
Computer Engineering and Technology 21st CCF Conference, NCCET 2017, Xiamen, China, August 16–18, 2017, Revised Selected Papers
Yazar 
Xu, Weixia. editor. Xiao, Liquan. editor. Li, Jinwen. editor. Zhang, Chengyi. editor. Zhu, Zhenzhen. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-10-7844-6
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11. 
Data Science and Analytics 4th International Conference on Recent Developments in Science, Engineering and Technology, REDSET 2017, Gurgaon, India, October 13-14, 2017, Revised Selected Papers için kapak resmi
Data Science and Analytics 4th International Conference on Recent Developments in Science, Engineering and Technology, REDSET 2017, Gurgaon, India, October 13-14, 2017, Revised Selected Papers
Yazar 
Panda, Brajendra. editor. (orcid)0000-0003-1117-9328 Sharma, Sudeep. editor. Roy, Nihar Ranjan. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-10-8527-7
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12. 
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method için kapak resmi
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Yazar 
Seok, Seonho. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-77872-3
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