Arama Sonuçlarını Sınırlandır
Yazar
SpringerLink (Online service)
(31)
Wiley InterScience (Online service)
(13)
Brody, Aaron L.
(3)
Han, Jung H.
(3)
Kirwan, Mark J.
(3)
Dil
Yayın Yılı
-
Konu
Food -- Packaging.
(35)
Electronic packaging.
(15)
Electronics.
(12)
Electronic books.
(11)
Microelectronic packaging.
(11)
Materyal Türü
Shelf Location
Kütüphane
Liste görünümüne geç
Küçük resim görünümüne geç
Eylem Seç
222 sonuç bulundu Arama sonuçlarına abone ol
000000000000DEFAULT_TR
Yazdır
73. 
Controlled/modified atmosphere/vacuum packaging of foods için kapak resmi
Controlled/modified atmosphere/vacuum packaging of foods
Yazar 
Brody, Aaron L., ed.
Yer Numarası 
TP 374 C66 1989
Format: 
Durum 
Beytepe Kütüphanesi~1
Rafta:
Kopya:
74. 
The science and technology of aerosol packaging için kapak resmi
The science and technology of aerosol packaging
Yazar 
Sciarra, John J., 1927- Stoller, Leonard, ed.
Yer Numarası 
TS 198.A3 S33 1974
Format: 
Durum 
Beytepe Kütüphanesi~1
Rafta:
Kopya:
75. 
MEMS/MOEMS packaging concepts, designs, materials, and processes için kapak resmi
MEMS/MOEMS packaging concepts, designs, materials, and processes
Yazar 
Gilleo, Ken.
Yer Numarası 
ONLINE
Elektronik Erişim 
Subscription required
Format: 
Durum 
Çevrimiçi Kütüphane~1
Rafta:
Kopya:
76. 
IEEE Transactions on components packaging and manufacturing technology C. için kapak resmi
IEEE Transactions on components packaging and manufacturing technology C.
Format: 
Durum 
~0
Rafta:
Kopya:
77. 
IEEE Transactions on components, packaging and manufacturing B. için kapak resmi
IEEE Transactions on components, packaging and manufacturing B.
Format: 
Durum 
~0
Rafta:
Kopya:
78. 
IEEE Transactions on components, packaging and manufacturing A. için kapak resmi
IEEE Transactions on components, packaging and manufacturing A.
Format: 
Durum 
~0
Rafta:
Kopya:
79. 
Biscuit, cookie and cracker production : process, production and packaging equipment için kapak resmi
Biscuit, cookie and cracker production : process, production and packaging equipment
Yazar 
Davidson, Iain, author.
Yer Numarası 
ONLINE
Elektronik Erişim 
ScienceDirect https://www.sciencedirect.com/science/book/9780128155790
Format: 
Durum 
Çevrimiçi Kütüphane~1
Rafta:
Kopya:
80. 
Advances in Graphic Communication, Printing and Packaging Proceedings of 2018 9th China Academic Conference on Printing and Packaging için kapak resmi
Advances in Graphic Communication, Printing and Packaging Proceedings of 2018 9th China Academic Conference on Printing and Packaging
Yazar 
Zhao, Pengfei. editor. Ouyang, Yun. editor. Xu, Min. editor. Yang, Li. editor. Ren, Yuhui. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-13-3663-8
Format: 
Durum 
Çevrimiçi Kütüphane~1
Rafta:
Kopya:
81. 
Nanomaterials for food packaging : materials, processing technologies, and safety issues için kapak resmi
Nanomaterials for food packaging : materials, processing technologies, and safety issues
Yazar 
Cerqueira, Miguel Ângelo Parente Ribeiro, editor. Lagaron, Jose Maria, editor. Castro, Lorenzo Miguel Pastrana, editor. Vicente, António Augusto Martins de Oliveira Soares, editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
ScienceDirect https://www.sciencedirect.com/science/book/9780323512718
Format: 
Durum 
Çevrimiçi Kütüphane~1
Rafta:
Kopya:
82. 
Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability için kapak resmi
Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Yazar 
Suganuma, Katsuaki, editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
ScienceDirect https://www.sciencedirect.com/science/book/9780081020944
Format: 
Durum 
Çevrimiçi Kütüphane~1
Rafta:
Kopya:
83. 
Applied Sciences in Graphic Communication and Packaging Proceedings of 2017 49th Conference of the International Circle of Educational Institutes for Graphic Arts Technology and Management & 8th China Academic Conference on Printing and Packaging için kapak resmi
Applied Sciences in Graphic Communication and Packaging Proceedings of 2017 49th Conference of the International Circle of Educational Institutes for Graphic Arts Technology and Management & 8th China Academic Conference on Printing and Packaging
Yazar 
Zhao, Pengfei. editor. Ouyang, Yun. editor. Xu, Min. editor. Yang, Li. editor. Ren, Yuhui. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-10-7629-9
Format: 
Durum 
Çevrimiçi Kütüphane~1
Rafta:
Kopya:
84. 
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method için kapak resmi
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Yazar 
Seok, Seonho. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-77872-3
Format: 
Durum 
Çevrimiçi Kütüphane~1
Rafta:
Kopya:
Eylem Seç