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1. 
Integration of Reusable Systems için kapak resmi
Integration of Reusable Systems
Yazar 
Bouabana-Tebibel, Thouraya. editor. Rubin, Stuart H. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-04717-1
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2. 
Formalisms for Reuse and Systems Integration için kapak resmi
Formalisms for Reuse and Systems Integration
Yazar 
Bouabana-Tebibel, Thouraya. editor. Rubin, Stuart H. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-16577-6
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3. 
5G-based smart hospitals and healthcare systems : evaluation, integration, and deployment için kapak resmi
5G-based smart hospitals and healthcare systems : evaluation, integration, and deployment
Yazar 
Kumar, Arun (Associate professor of electronics), editor. Chakravarty, Sumit (Associate professor of electrical engineering), editor. Aravinda, K., 1966- editor. Sharma, Mohit Kumar (Assistant professor), editor.
Yer Numarası 
RA971.6
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003403678
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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4. 
INTEGRATION OF AI-BASED MANUFACTURING AND INDUSTRIAL ENGINEERING SYSTEMS WITH THE INTERNET OF THINGS için kapak resmi
INTEGRATION OF AI-BASED MANUFACTURING AND INDUSTRIAL ENGINEERING SYSTEMS WITH THE INTERNET OF THINGS
Yazar 
Bhambri, Pankaj. Rani, Sita. Balas, Valentina Emilia. Elngar, Ahmed A.
Yer Numarası 
Q335
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003383505
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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5. 
VLSI-SoC: Design and Engineering of Electronics Systems Based on New Computing Paradigms 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, Verona, Italy, October 8–10, 2018, Revised and Extended Selected Papers için kapak resmi
VLSI-SoC: Design and Engineering of Electronics Systems Based on New Computing Paradigms 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, Verona, Italy, October 8–10, 2018, Revised and Extended Selected Papers
Yazar 
Bombieri, Nicola. editor. Pravadelli, Graziano. editor. Fujita, Masahiro. editor. Austin, Todd. editor. Reis, Ricardo. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-030-23425-6
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6. 
Data Analytics for Renewable Energy Integration. Technologies, Systems and Society 6th ECML PKDD Workshop, DARE 2018, Dublin, Ireland, September 10, 2018, Revised Selected Papers için kapak resmi
Data Analytics for Renewable Energy Integration. Technologies, Systems and Society 6th ECML PKDD Workshop, DARE 2018, Dublin, Ireland, September 10, 2018, Revised Selected Papers
Yazar 
Woon, Wei Lee. editor. Aung, Zeyar. editor. Catalina Feliú, Alejandro. editor. Madnick, Stuart. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-030-04303-2
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7. 
Embedded Platforms for UAS Landing Path and Obstacle Detection Integration and Development of Unmanned Aircraft Systems için kapak resmi
Embedded Platforms for UAS Landing Path and Obstacle Detection Integration and Development of Unmanned Aircraft Systems
Yazar 
Papa, Umberto. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-73174-2
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8. 
Multisensor Fusion and Integration for Intelligent Systems An Edition of the Selected Papers from the IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems 2008 için kapak resmi
Multisensor Fusion and Integration for Intelligent Systems An Edition of the Selected Papers from the IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems 2008
Yazar 
Hahn, Hernsoo. editor. Ko, Hanseok. editor. Lee, Sukhan. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
http://dx.doi.org/10.1007/978-3-540-89859-7
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9. 
Artificial Intelligence-Empowered Bio-medical Applications Challenges, Solutions and Development Guidelines için kapak resmi
Artificial Intelligence-Empowered Bio-medical Applications Challenges, Solutions and Development Guidelines
Yazar 
Panagoulias, Dimitrios P. author. (orcid)0000-0002-9421-141X Tsihrintzis, George A. author. Virvou, Maria. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-90174-4
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10. 
Fortifying the Future Harnessing AI for Transformative Cybersecurity Training için kapak resmi
Fortifying the Future Harnessing AI for Transformative Cybersecurity Training
Yazar 
Rana, Shaila. author. (orcid)0000-0001-5834-2802 Chicone, Rhonda. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-81780-9
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11. 
AI-Enabled Electronic Circuit and System Design From Ideation to Utilization için kapak resmi
AI-Enabled Electronic Circuit and System Design From Ideation to Utilization
Yazar 
Iranmanesh, Ali. editor. Sayadi, Hossein. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-71436-8
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12. 
Blockchain, Metaverse and Trustworthy Systems 6th International Conference, BlockSys 2024, Hangzhou, China, July 12-14, 2024, Revised Selected Papers, Part I için kapak resmi
Blockchain, Metaverse and Trustworthy Systems 6th International Conference, BlockSys 2024, Hangzhou, China, July 12-14, 2024, Revised Selected Papers, Part I
Yazar 
He, Debiao. editor. (orcid)0000-0002-2446-7436 Wu, Jiajing. editor. (orcid)0000-0001-5155-8547 Wang, Chen. editor. (orcid)0000-0002-3951-3159 Huang, Huawei. editor. (orcid)0000-0002-7035-6446 SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-96-1411-0
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