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1. 
Design of Image Processing Embedded Systems Using Multidimensional Data Flow için kapak resmi
Design of Image Processing Embedded Systems Using Multidimensional Data Flow
Yazar 
Keinert, Joachim. author. Teich, Jürgen. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
http://dx.doi.org/10.1007/978-1-4419-7182-1
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Durum 
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2. 
Computer-Aided Architectural Design. INTERCONNECTIONS: Co-computing Beyond Boundaries 20th International Conference, CAAD Futures 2023, Delft, The Netherlands, July 5-7, 2023, Selected Papers için kapak resmi
Computer-Aided Architectural Design. INTERCONNECTIONS: Co-computing Beyond Boundaries 20th International Conference, CAAD Futures 2023, Delft, The Netherlands, July 5-7, 2023, Selected Papers
Yazar 
Turrin, Michela. editor. Andriotis, Charalampos. editor. Rafiee, Azarakhsh. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-37189-9
Format: 
Durum 
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3. 
Advances in Production Management Systems. Production Management Systems for Responsible Manufacturing, Service, and Logistics Futures IFIP WG 5.7 International Conference, APMS 2023, Trondheim, Norway, September 17-21, 2023, Proceedings, Part II için kapak resmi
Advances in Production Management Systems. Production Management Systems for Responsible Manufacturing, Service, and Logistics Futures IFIP WG 5.7 International Conference, APMS 2023, Trondheim, Norway, September 17-21, 2023, Proceedings, Part II
Yazar 
Alfnes, Erlend. editor. Romsdal, Anita. editor. Strandhagen, Jan Ola. editor. von Cieminski, Gregor. editor. Romero, David. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-43666-6
Format: 
Durum 
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4. 
Industrial Networks and Intelligent Systems 9th EAI International Conference, INISCOM 2023, Ho Chi Minh City, Vietnam, August 2-3, 2023, Proceedings için kapak resmi
Industrial Networks and Intelligent Systems 9th EAI International Conference, INISCOM 2023, Ho Chi Minh City, Vietnam, August 2-3, 2023, Proceedings
Yazar 
Vo, Nguyen-Son. editor. Tran, Hoai-An. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-47359-3
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5. 
Telematics and Computing 12th International Congress, WITCOM 2023, Puerto Vallarta, Mexico, November 13-17, 2023, Proceedings için kapak resmi
Telematics and Computing 12th International Congress, WITCOM 2023, Puerto Vallarta, Mexico, November 13-17, 2023, Proceedings
Yazar 
Mata-Rivera, Miguel Félix. editor. Zagal-Flores, Roberto. editor. Barria-Huidobro, Cristian. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-45316-8
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6. 
Applied Reconfigurable Computing. Architectures, Tools, and Applications 19th International Symposium, ARC 2023, Cottbus, Germany, September 27-29, 2023, Proceedings için kapak resmi
Applied Reconfigurable Computing. Architectures, Tools, and Applications 19th International Symposium, ARC 2023, Cottbus, Germany, September 27-29, 2023, Proceedings
Yazar 
Palumbo, Francesca. editor. Keramidas, Georgios. editor. Voros, Nikolaos. editor. Diniz, Pedro C. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-42921-7
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Durum 
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7. 
The 2021 International Conference on Smart Technologies and Systems for Internet of Things STSIoT2021 için kapak resmi
The 2021 International Conference on Smart Technologies and Systems for Internet of Things STSIoT2021
Yazar 
Ahmad, Ishfaq. editor. Ye, Jun. editor. Liu, Weidong. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-19-3632-6
Format: 
Durum 
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8. 
AI, IoT, Big Data and Cloud Computing for Industry 4.0 için kapak resmi
AI, IoT, Big Data and Cloud Computing for Industry 4.0
Yazar 
Neustein, Amy. editor. Mahalle, Parikshit N. editor. Joshi, Prachi. editor. Shinde, Gitanjali Rahul. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-29713-7
Format: 
Durum 
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9. 
Intelligent Communication Technologies and Virtual Mobile Networks Proceedings of ICICV 2023 için kapak resmi
Intelligent Communication Technologies and Virtual Mobile Networks Proceedings of ICICV 2023
Yazar 
Rajakumar, G. editor. Du, Ke-Lin. editor. Rocha, Álvaro. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-99-1767-9
Format: 
Durum 
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10. 
Advances in Manufacturing, Automation, Design and Energy Technologies Proceedings from ICoFT 2021 için kapak resmi
Advances in Manufacturing, Automation, Design and Energy Technologies Proceedings from ICoFT 2021
Yazar 
Sivaram, N. M. editor. Sankaranarayanasamy, K. editor. Davim, J. Paulo. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-99-1288-9
Format: 
Durum 
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11. 
International Conference on Advanced Intelligent Systems for Sustainable Development Volume 1 - Advanced Intelligent Systems on Artificial Intelligence, Software, and Data Science için kapak resmi
International Conference on Advanced Intelligent Systems for Sustainable Development Volume 1 - Advanced Intelligent Systems on Artificial Intelligence, Software, and Data Science
Yazar 
Kacprzyk, Janusz. editor. Ezziyyani, Mostafa. editor. Balas, Valentina Emilia. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-26384-2
Format: 
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12. 
Advances and Applications of Artificial Intelligence & Machine Learning Proceedings of ICAAAIML 2022 için kapak resmi
Advances and Applications of Artificial Intelligence & Machine Learning Proceedings of ICAAAIML 2022
Yazar 
Unhelkar, Bhuvan. editor. Pandey, Hari Mohan. editor. Agrawal, Arun Prakash. editor. Choudhary, Ankur. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-99-5974-7
Format: 
Durum 
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