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1. 
COMPUTER-INTEGRATED ENGINEERING DESIGN AND MANUFACTURE modelling, simulation, and... analysis using autocad, mastercam, and arena. için kapak resmi
COMPUTER-INTEGRATED ENGINEERING DESIGN AND MANUFACTURE modelling, simulation, and... analysis using autocad, mastercam, and arena.
Yazar 
Nyemba, Wilson R.
Yer Numarası 
TA174
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003559832
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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2. 
Engineering materials, structures, systems and methods for a more sustainable future için kapak resmi
Engineering materials, structures, systems and methods for a more sustainable future
Yazar 
International Conference on Structural Engineering, Mechanics, and Computation (9th : 2025 : Cape Town, South Africa), creator. Zingoni, Alphose, editor.
Yer Numarası 
TA630
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003488644
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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3. 
Engineering materials, structures, systems and methods for a more sustainable future için kapak resmi
Engineering materials, structures, systems and methods for a more sustainable future
Yazar 
International Conference on Structural Engineering, Mechanics, and Computation (9th : 2025 : Cape Town, South Africa), creator. Zingoni, Alphose, editor.
Yer Numarası 
TA630
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003677895
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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4. 
MODELING AND SIMULATION IN THERMAL AND FLUIDS ENGINEERING için kapak resmi
MODELING AND SIMULATION IN THERMAL AND FLUIDS ENGINEERING
Yazar 
Murugesan, Krishnan.
Yer Numarası 
TA357
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003248071
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format: 
Durum 
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5. 
Multiphysics modeling with application to biomedical engineering için kapak resmi
Multiphysics modeling with application to biomedical engineering
Yazar 
Yang, Z., author.
Yer Numarası 
R857 .M3
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9780367510800
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format: 
Durum 
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