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1. 
Artificial Intelligence for Cyber-Physical Systems Hardening için kapak resmi
Artificial Intelligence for Cyber-Physical Systems Hardening
Yazar 
Traore, Issa. editor. Woungang, Isaac. editor. Saad, Sherif. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-16237-4
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2. 
Data analytics and artificial intelligence for predictive maintenance in smart manufacturing için kapak resmi
Data analytics and artificial intelligence for predictive maintenance in smart manufacturing
Yazar 
Tyagi, Amit Kumar, 1988- editor. Tiwari, Shrikant, editor. Soni, Gulshan, editor.
Yer Numarası 
TS183
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003480860
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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3. 
Urban freight analytics : big data, models, and artificial intelligence için kapak resmi
Urban freight analytics : big data, models, and artificial intelligence
Yazar 
Taniguchi, Eiichi, author. Thompson, Russell G., 1962- author. Qureshi, Ali G. (Ali Gul), author.
Yer Numarası 
TA1205
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003261513
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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4. 
IoT, Big Data and AI for Improving Quality of Everyday Life: Present and Future Challenges IOT, Data Science and Artificial Intelligence Technologies için kapak resmi
IoT, Big Data and AI for Improving Quality of Everyday Life: Present and Future Challenges IOT, Data Science and Artificial Intelligence Technologies
Yazar 
Singh, Pradeep Kumar. editor. Wierzchoń, Sławomir T. editor. Pawłowski, Wiesław. editor. Kar, Arpan Kumar. editor. Kumar, Yugal. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-35783-1
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5. 
Artificial Intelligence in Education Technologies: New Development and Innovative Practices Proceedings of 2022 3rd International Conference on Artificial Intelligence in Education Technology için kapak resmi
Artificial Intelligence in Education Technologies: New Development and Innovative Practices Proceedings of 2022 3rd International Conference on Artificial Intelligence in Education Technology
Yazar 
Cheng, Eric C. K. editor. (orcid)0000-0003-1801-7321 Wang, Tianchong. editor. Schlippe, Tim. editor. Beligiannis, Grigorios N. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-19-8040-4
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6. 
Big data and artificial intelligence for healthcare applications için kapak resmi
Big data and artificial intelligence for healthcare applications
Yazar 
Saxena, Ankur, editor. Brault, Nicolas, editor. Rashid, Shazia, editor.
Yer Numarası 
R858 .A3
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003093770
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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7. 
SMART APPLICATIONS OF ARTIFICIAL INTELLIGENCE AND BIG DATA için kapak resmi
SMART APPLICATIONS OF ARTIFICIAL INTELLIGENCE AND BIG DATA
Yer Numarası 
HD30.23
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781032664293
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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8. 
Data-driven systems and intelligent applications için kapak resmi
Data-driven systems and intelligent applications
Yazar 
Ghonge, Mangesh M., editor. Chaitanya, N. Krishna, editor. Pradeep, N., 1977- editor. Garg, Harish, editor. Bruno, Alessandro (Computer engineer), editor.
Yer Numarası 
QA76.9 .B45
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003388449
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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9. 
Advanced AI and Data Science Applications için kapak resmi
Advanced AI and Data Science Applications
Yazar 
Sivabalaselvamani, D. Revathy, G., 1987- Singh, Ranjit Singh Sarban.
Yer Numarası 
Q335
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003543527
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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10. 
Why data science projects fail : the harsh realities of implementing AI and analytics, without the hype için kapak resmi
Why data science projects fail : the harsh realities of implementing AI and analytics, without the hype
Yazar 
Gray, Doug (Douglas A.), author. Shellsear, Evan, author.
Yer Numarası 
QA76.9 .Q36
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781032661360
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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11. 
Big data : techniques and technologies in geoinformatics için kapak resmi
Big data : techniques and technologies in geoinformatics
Yazar 
Karimi, Hassan A., editor.
Yer Numarası 
G70.2
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003406969
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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12. 
It's all analytics. Part III, The applications of AI, analytics, and data science için kapak resmi
It's all analytics. Part III, The applications of AI, analytics, and data science
Yazar 
Burk, Scott, author. Miner, Gary, author.
Yer Numarası 
Q335
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9780429343971
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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