chapter 1 Overview of Lead-Free Solder Issues Including Selection / chapter 2 Health and Environmental Effects of Lead and Other Commonly Used Elements in Microelectronics / chapter 3 Environmental Impact of Lead and Alternatives in Electronics / chapter 4 Environmental Stewardship with Regional Perspectives and Drives of the Lead-Free Issue / chapter 5 Market, Product, and Corporate Policy Trends / chapter 6 The Metallurgical Aspects, Properties, and Applications of Solders from the Lead�Tin System / chapter 7 Physical Basis for Mechanical Properties of Solders / chapter 8 Sn-Ag and Sn-Ag-X Solders and Properties / chapter 9 Bi-Sn, Sn-Sb, Sn-Cu, Sn-Zn, and Sn-In Solder-Based Systems and Their Properties / chapter 10 High-Temperature Lead-Free Solders with Dispersoids / chapter 11 Solder Wetting and Spreading / chapter 12 Lead-Free Finishes for Printed Circuit Boards and Components Rob Schetty -- chapter 13 Formation of Intermetallic Compounds at Pb-Sn/Metal and Lead- Free/Metal Interfaces in Solder Joints / chapter 14 Electronics Assembly and the Impact of Lead-Free Materials / chapter 15 Use of Inert Atmospheres in Lead-Free Soldering / chapter 16 Pb-Free Component Conversion and Some Manufacturing Experiences / chapter 17 Major International Lead (Pb)-Free Solder Studies / chapter 18 Electrically Conductive Adhesives�A Lead-Free Alternative / chapter 19 Reliability Aspects of Lead-Free Solders in Electronic Assemblies / chapter 20 The Physics and Materials Science of Electromigration and Thermomigration in Solders / chapter 21 The Structure and Kinetics of Tin-Whisker Formation and Growth on High Tin Content Finishes / chapter 22 Degradation Phenomena