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1. 
Emotional Artificial Intelligence and Metaverse için kapak resmi
Emotional Artificial Intelligence and Metaverse
Yazar 
Lee, Roger. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-16485-9
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2. 
Integrated Science of Global Epidemics için kapak resmi
Integrated Science of Global Epidemics
Yazar 
Rezaei, Nima. editor. (orcid)0000-0002-3836-1827 SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-17778-1
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3. 
Advances in Reliability and Maintainability Methods and Engineering Applications Essays in Honor of Professor Hong-Zhong Huang on his 60th Birthday için kapak resmi
Advances in Reliability and Maintainability Methods and Engineering Applications Essays in Honor of Professor Hong-Zhong Huang on his 60th Birthday
Yazar 
Liu, Yu. editor. Wang, Dong. editor. Mi, Jinhua. editor. Li, He. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-28859-3
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4. 
Recent Developments and the New Directions of Research, Foundations, and Applications Selected Papers of the 8th World Conference on Soft Computing, February 03-05, 2022, Baku, Azerbaijan, Vol. I için kapak resmi
Recent Developments and the New Directions of Research, Foundations, and Applications Selected Papers of the 8th World Conference on Soft Computing, February 03-05, 2022, Baku, Azerbaijan, Vol. I
Yazar 
Shahbazova, Shahnaz N. editor. Abbasov, Ali M. editor. Kreinovich, Vladik. editor. Kacprzyk, Janusz. editor. Batyrshin, Ildar Z. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-20153-0
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5. 
Advances in Functional and Smart Materials Select Proceedings of ICFMMP 2021 için kapak resmi
Advances in Functional and Smart Materials Select Proceedings of ICFMMP 2021
Yazar 
Prakash, Chander. editor. Singh, Sunpreet. editor. Krolczyk, Grzegorz. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-19-4147-4
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6. 
Progress in Life Cycle Assessment 2021 için kapak resmi
Progress in Life Cycle Assessment 2021
Yazar 
Hesser, Franziska. editor. Kral, Iris. editor. Obersteiner, Gudrun. editor. Hörtenhuber, Stefan. editor. Kühmaier, Martin. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-29294-1
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7. 
Dependable Computer Systems and Networks Proceedings of the Eighteenth International Conference on Dependability of Computer Systems DepCoS-RELCOMEX, July 3-7, 2023, Brunów, Poland için kapak resmi
Dependable Computer Systems and Networks Proceedings of the Eighteenth International Conference on Dependability of Computer Systems DepCoS-RELCOMEX, July 3-7, 2023, Brunów, Poland
Yazar 
Zamojski, Wojciech. editor. Mazurkiewicz, Jacek. editor. Sugier, Jarosław. editor. Walkowiak, Tomasz. editor. Kacprzyk, Janusz. editor. (orcid)0000-0003-4187-5877
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-37720-4
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8. 
Augmented Reality and Artificial Intelligence The Fusion of Advanced Technologies için kapak resmi
Augmented Reality and Artificial Intelligence The Fusion of Advanced Technologies
Yazar 
Geroimenko, Vladimir. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-27166-3
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9. 
Cyberbiosecurity A New Field to Deal with Emerging Threats için kapak resmi
Cyberbiosecurity A New Field to Deal with Emerging Threats
Yazar 
Greenbaum, Dov. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-26034-6
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10. 
Soft Computing and Its Engineering Applications 4th International Conference, icSoftComp 2022, Changa, Anand, India, December 9-10, 2022, Proceedings için kapak resmi
Soft Computing and Its Engineering Applications 4th International Conference, icSoftComp 2022, Changa, Anand, India, December 9-10, 2022, Proceedings
Yazar 
Patel, Kanubhai K. editor. Santosh, K. C. editor. Patel, Atul. editor. Ghosh, Ashish. editor. (orcid) SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-27609-5
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11. 
Collaborative Networks in Digitalization and Society 5.0 24th IFIP WG 5.5 Working Conference on Virtual Enterprises, PRO-VE 2023, Valencia, Spain, September 27-29, 2023, Proceedings için kapak resmi
Collaborative Networks in Digitalization and Society 5.0 24th IFIP WG 5.5 Working Conference on Virtual Enterprises, PRO-VE 2023, Valencia, Spain, September 27-29, 2023, Proceedings
Yazar 
Camarinha-Matos, Luis M. editor. Boucher, Xavier. editor. Ortiz, Angel. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-42622-3
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12. 
Distributed, Ambient and Pervasive Interactions 11th International Conference, DAPI 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part II için kapak resmi
Distributed, Ambient and Pervasive Interactions 11th International Conference, DAPI 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part II
Yazar 
Streitz, Norbert A. editor. Konomi, Shin'ichi. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-34609-5
Format: 
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