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1. 
Applications of mathematical modeling, machine learning, and intelligent computing for industrial development için kapak resmi
Applications of mathematical modeling, machine learning, and intelligent computing for industrial development
Yazar 
Jain, Madhu, 1959- editor.
Yer Numarası 
T59.6
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003386599
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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2. 
Internet of things : applications for sustainable development için kapak resmi
Internet of things : applications for sustainable development
Yazar 
Lal, Niranjan, editor.
Yer Numarası 
TK5105.8857
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003226888
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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3. 
ARTIFICIAL INTELLIGENCE, BLOCKCHAIN, COMPUTING AND SECURITY. VOLUME 2 için kapak resmi
ARTIFICIAL INTELLIGENCE, BLOCKCHAIN, COMPUTING AND SECURITY. VOLUME 2
Yazar 
International Conference on Artificial Intelligence, Blockchain, Computing and Security (2023 : Greater Noida, India), creator. Dagur, Arvind, editor. Singh, Karan, 1981 May 20- editor. Mehra, Pawan Singh, editor. Shukla, Dhirendra Kumar, editor.
Yer Numarası 
Q335
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781032684994
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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4. 
Swarm intelligence : trends and applications için kapak resmi
Swarm intelligence : trends and applications
Yazar 
Pinheiro dos Santos, Wellington, editor. Carneiro Gomes, Juliana, editor. Augusto de Freitas Barbosa, Valter, editor.
Yer Numarası 
Q342
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003190141
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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5. 
Emerging low-power semiconductor devices için kapak resmi
Emerging low-power semiconductor devices
Yazar 
Tayal, Shubham, editor.
Yer Numarası 
TK7874.66 .E44 2023 EB
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003240778
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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6. 
Cognitive IoT : emerging technology towards human wellbeing için kapak resmi
Cognitive IoT : emerging technology towards human wellbeing
Yazar 
Patra, J. P., author. Verma, Gurudatta, author.
Yer Numarası 
RA566
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003310341
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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7. 
Software durability concepts and practices için kapak resmi
Software durability concepts and practices
Yazar 
Kumar, Rajeev, 1991- author. Khan, Suhel Ahmad, author. Khan, R. A. (Raees Ahmad), author.
Yer Numarası 
QA76.76 .Q35
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003322351
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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8. 
Human factors in engineering : manufacturing systems, automation, and interactions için kapak resmi
Human factors in engineering : manufacturing systems, automation, and interactions
Yazar 
Mrugalska, Beata, editor. Ahram, Tareq Z., editor. Karwowski, Waldemar, 1953- editor.
Yer Numarası 
T59.7
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003383444
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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9. 
Computer Supported Cooperative Work and Social Computing 17th CCF Conference, ChineseCSCW 2022, Taiyuan, China, November 25-27, 2022, Revised Selected Papers, Part I için kapak resmi
Computer Supported Cooperative Work and Social Computing 17th CCF Conference, ChineseCSCW 2022, Taiyuan, China, November 25-27, 2022, Revised Selected Papers, Part I
Yazar 
Sun, Yuqing. editor. Lu, Tun. editor. Guo, Yinzhang. editor. Song, Xiaoxia. editor. Fan, Hongfei. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-99-2356-4
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10. 
Computer Science and Education 17th International Conference, ICCSE 2022, Ningbo, China, August 18-21, 2022, Revised Selected Papers, Part II için kapak resmi
Computer Science and Education 17th International Conference, ICCSE 2022, Ningbo, China, August 18-21, 2022, Revised Selected Papers, Part II
Yazar 
Hong, Wenxing. editor. Weng, Yang. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-99-2446-2
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11. 
Collaborative Networks in Digitalization and Society 5.0 24th IFIP WG 5.5 Working Conference on Virtual Enterprises, PRO-VE 2023, Valencia, Spain, September 27-29, 2023, Proceedings için kapak resmi
Collaborative Networks in Digitalization and Society 5.0 24th IFIP WG 5.5 Working Conference on Virtual Enterprises, PRO-VE 2023, Valencia, Spain, September 27-29, 2023, Proceedings
Yazar 
Camarinha-Matos, Luis M. editor. Boucher, Xavier. editor. Ortiz, Angel. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-42622-3
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12. 
RoboCup 2022: Robot World Cup XXV için kapak resmi
RoboCup 2022: Robot World Cup XXV
Yazar 
Eguchi, Amy. editor. Lau, Nuno. editor. Paetzel-Prüsmann, Maike. editor. Wanichanon, Thanapat. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-28469-4
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