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1. 
Interoperability of Enterprise Software and Applications için kapak resmi
Interoperability of Enterprise Software and Applications
Yazar 
Konstantas, Dimitri. editor. Bourrières, Jean-Paul. editor. Léonard, Michel. editor. Boudjlida, Nacer. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
http://dx.doi.org/10.1007/1-84628-152-0
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2. 
Designing Software Intensive Products Integrating Engineering and Intellectual Property Management to the Development of Innovative Products için kapak resmi
Designing Software Intensive Products Integrating Engineering and Intellectual Property Management to the Development of Innovative Products
Yazar 
Atem de Carvalho, Rogerio. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-08893-3
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3. 
Advances in Automotive Production Technology - Towards Software-Defined Manufacturing and Resilient Supply Chains Stuttgart Conference on Automotive Production (SCAP2022) için kapak resmi
Advances in Automotive Production Technology - Towards Software-Defined Manufacturing and Resilient Supply Chains Stuttgart Conference on Automotive Production (SCAP2022)
Yazar 
Kiefl, Niklas. editor. Wulle, Frederik. editor. Ackermann, Clemens. editor. Holder, Daniel. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-27933-1
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4. 
Multi-Disciplinary Engineering for Cyber-Physical Production Systems Data Models and Software Solutions for Handling Complex Engineering Projects için kapak resmi
Multi-Disciplinary Engineering for Cyber-Physical Production Systems Data Models and Software Solutions for Handling Complex Engineering Projects
Yazar 
Biffl, Stefan. editor. (orcid)0000-0002-3413-7780 Lüder, Arndt. editor. Gerhard, Detlef. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-56345-9
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5. 
Data Envelopment Analysis A Comprehensive Text with Models, Applications, References and DEA-Solver Software için kapak resmi
Data Envelopment Analysis A Comprehensive Text with Models, Applications, References and DEA-Solver Software
Yazar 
Cooper, William W. author. Seiford, Lawrence M. author. Tone, Kaoru. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
http://dx.doi.org/10.1007/978-0-387-45283-8
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6. 
Introduction to Data Envelopment Analysis and Its Uses With DEA-Solver Software and References için kapak resmi
Introduction to Data Envelopment Analysis and Its Uses With DEA-Solver Software and References
Yazar 
Cooper, William W. author. Seiford, Lawrence M. author. Tone, Kaoru. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
http://dx.doi.org/10.1007/0-387-29122-9
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7. 
Supply Chain Management and Advanced Planning Concepts, Models, Software and Case Studies için kapak resmi
Supply Chain Management and Advanced Planning Concepts, Models, Software and Case Studies
Yazar 
Stadtler, Hartmut. editor. Kilger, Christoph. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
http://dx.doi.org/10.1007/b106298
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8. 
Automated Process Planning for Additive Manufacturing with Directed Energy Deposition için kapak resmi
Automated Process Planning for Additive Manufacturing with Directed Energy Deposition
Yazar 
Prakash, Vishnuu Jothi. author. (orcid)0000-0002-8778-8026 SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-87666-0
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9. 
Cost Engineering Systems for Manufacturing Enterprises Methods, Processes and Experience Reports from Practice için kapak resmi
Cost Engineering Systems for Manufacturing Enterprises Methods, Processes and Experience Reports from Practice
Yazar 
Liu, Xiaoyi. author. (orcid)0000-0001-5894-8388 SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-96-5234-1
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10. 
Future Industrial Internet Second Future Industrial Internet Symposium, FII 2024, Shenzhen, China, August 23, 2024, Proceedings için kapak resmi
Future Industrial Internet Second Future Industrial Internet Symposium, FII 2024, Shenzhen, China, August 23, 2024, Proceedings
Yazar 
Yin, Hao. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-96-6736-9
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11. 
Proceedings of the International Conferences on Digital Technology Driven Engineering 2024 2nd International Conference on Optimization Driven Architectural Design (OPTARCH) için kapak resmi
Proceedings of the International Conferences on Digital Technology Driven Engineering 2024 2nd International Conference on Optimization Driven Architectural Design (OPTARCH)
Yazar 
Lagaros, Nikos D. editor. (orcid)0000-0001-6114-9632 Alrousan, Rajai Z. editor. Abdalla, Khairedin M. editor. Phocas, Marios C. editor. Marano, Giuseppe Carlo. editor. (orcid)0000-0001-8472-2956
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-92754-6
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12. 
Business Information Systems 25th International Conference, BIS 2025, Poznań, Poland, June 25-27, 2025, Proceedings için kapak resmi
Business Information Systems 25th International Conference, BIS 2025, Poznań, Poland, June 25-27, 2025, Proceedings
Yazar 
Węcel, Krzysztof. editor. (orcid)0000-0001-5641-3160 SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-94193-1
Format: 
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