Arama Sonuçlarını Sınırlandır
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SpringerLink (Online service)
(14)
Bouabana-Tebibel, Thouraya. editor.
(2)
Gupta, Deepak. editor.
(2)
Hassanien, Aboul Ella. editor.
(2)
Khanna, Ashish. editor.
(2)
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16 sonuç bulundu Arama sonuçlarına abone ol
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1. 
Integration of Reusable Systems için kapak resmi
Integration of Reusable Systems
Yazar 
Bouabana-Tebibel, Thouraya. editor. Rubin, Stuart H. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-04717-1
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2. 
Formalisms for Reuse and Systems Integration için kapak resmi
Formalisms for Reuse and Systems Integration
Yazar 
Bouabana-Tebibel, Thouraya. editor. Rubin, Stuart H. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-16577-6
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3. 
5G-based smart hospitals and healthcare systems : evaluation, integration, and deployment için kapak resmi
5G-based smart hospitals and healthcare systems : evaluation, integration, and deployment
Yazar 
Kumar, Arun (Associate professor of electronics), editor. Chakravarty, Sumit (Associate professor of electrical engineering), editor. Aravinda, K., 1966- editor. Sharma, Mohit Kumar (Assistant professor), editor.
Yer Numarası 
RA971.6
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003403678
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format: 
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4. 
INTEGRATION OF AI-BASED MANUFACTURING AND INDUSTRIAL ENGINEERING SYSTEMS WITH THE INTERNET OF THINGS için kapak resmi
INTEGRATION OF AI-BASED MANUFACTURING AND INDUSTRIAL ENGINEERING SYSTEMS WITH THE INTERNET OF THINGS
Yazar 
Bhambri, Pankaj. Rani, Sita. Balas, Valentina Emilia. Elngar, Ahmed A.
Yer Numarası 
Q335
Elektronik Erişim 
Taylor & Francis https://www.taylorfrancis.com/books/9781003383505
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format: 
Durum 
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5. 
VLSI-SoC: Design and Engineering of Electronics Systems Based on New Computing Paradigms 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, Verona, Italy, October 8–10, 2018, Revised and Extended Selected Papers için kapak resmi
VLSI-SoC: Design and Engineering of Electronics Systems Based on New Computing Paradigms 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, Verona, Italy, October 8–10, 2018, Revised and Extended Selected Papers
Yazar 
Bombieri, Nicola. editor. Pravadelli, Graziano. editor. Fujita, Masahiro. editor. Austin, Todd. editor. Reis, Ricardo. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-030-23425-6
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6. 
Data Analytics for Renewable Energy Integration. Technologies, Systems and Society 6th ECML PKDD Workshop, DARE 2018, Dublin, Ireland, September 10, 2018, Revised Selected Papers için kapak resmi
Data Analytics for Renewable Energy Integration. Technologies, Systems and Society 6th ECML PKDD Workshop, DARE 2018, Dublin, Ireland, September 10, 2018, Revised Selected Papers
Yazar 
Woon, Wei Lee. editor. Aung, Zeyar. editor. Catalina Feliú, Alejandro. editor. Madnick, Stuart. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-030-04303-2
Format: 
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7. 
Embedded Platforms for UAS Landing Path and Obstacle Detection Integration and Development of Unmanned Aircraft Systems için kapak resmi
Embedded Platforms for UAS Landing Path and Obstacle Detection Integration and Development of Unmanned Aircraft Systems
Yazar 
Papa, Umberto. author. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-319-73174-2
Format: 
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8. 
Multisensor Fusion and Integration for Intelligent Systems An Edition of the Selected Papers from the IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems 2008 için kapak resmi
Multisensor Fusion and Integration for Intelligent Systems An Edition of the Selected Papers from the IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems 2008
Yazar 
Hahn, Hernsoo. editor. Ko, Hanseok. editor. Lee, Sukhan. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
http://dx.doi.org/10.1007/978-3-540-89859-7
Format: 
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9. 
Springer Handbook of Automation için kapak resmi
Springer Handbook of Automation
Yazar 
Nof, Shimon Y. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-030-96729-1
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10. 
Machine Learning and the Internet of Things in Education Models and Applications için kapak resmi
Machine Learning and the Internet of Things in Education Models and Applications
Yazar 
Idoko, John Bush. editor. Abiyev, Rahib. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-42924-8
Format: 
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11. 
Proceedings of 2023 Chinese Intelligent Systems Conference Volume III için kapak resmi
Proceedings of 2023 Chinese Intelligent Systems Conference Volume III
Yazar 
Jia, Yingmin. editor. Zhang, Weicun. editor. Fu, Yongling. editor. Wang, Jiqiang. editor. SpringerLink (Online service)
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-99-6886-2
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12. 
Proceedings of Third Doctoral Symposium on Computational Intelligence DoSCI 2022 için kapak resmi
Proceedings of Third Doctoral Symposium on Computational Intelligence DoSCI 2022
Yazar 
Khanna, Ashish. editor. Gupta, Deepak. editor. Kansal, Vineet. editor. Fortino, Giancarlo. editor. Hassanien, Aboul Ella. editor.
Yer Numarası 
ONLINE
Elektronik Erişim 
https://doi.org/10.1007/978-981-19-3148-2
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