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SpringerLink (Online service)

(17)

Wiley InterScience (Online service)

(5)

Gross, Dietmar. author.

(3)

Seelig, Thomas. author.

(3)

Hausselt, Jürgen.

(2)

(2)

Wang, Linbing, 1963-

(2)

(1)

Aboudi, Jacob, 1935-

(1)

American Society of Civil Engineers.

(1)

Ananthasuresh, Gondi Kondaiah. editor.

(1)

(1)

Auberton-Herv�, A. J., e

(1)

Bai, Y. L. editor.

(1)

Baidyk, Tatiana. author.

(1)

Baltá-Calleja, F. J.

(1)

Bednarcyk, Brett A.

(1)

Berg, A. van den (Albert)

(1)

Berlin, Charles I., ed.

(1)

Beskok, Ali, 1966- ort. yaz.

(1)

Bobbin, Richard P., ed.

(1)

Butcher, Cliff. author.

(1)

Cambou, Bernard.

(1)

Chau, Kam-Tim. editor.

(1)

Chen, Zengtao. author.

(1)

Cherkaoui, Mohammed.

(1)

Corves, Burkhard. editor.

(1)

(1)

Dvorak, George. author.

(1)

(1)

GeoShanghai International Conference (2010)

(1)

(1)

Institute of Electrical and Electronics Engineers.

(1)

International Conference on Creepage, Shrinkage and Durability of Concrete and Concrete structures (8th : 2008 : Ise-Shima, Japan)

(1)

International Conference on Modelling and Computation in Engineering (2010 : Hong Kong, China)

(1)

Iyer, S. S., ed.

(1)

Jean, Michel, 1940-

(1)

Kachanov, Mark. author.

(1)

Kandlikar, S. G. (Satish G.)

(1)

Karniadakis, George.

(1)

Kishore Kumar, S. editor.

(1)

Kondo, Djimédo.

(1)

Krajcinovic, Dusan.

(1)

Kussul, Ernst. author.

(1)

(1)

(1)

Meguid, Shaker A. editor.

(1)

Meier, Roger (Roger W.)

(1)

Meyers, Marc A.

(1)

Michler, Goerg H. (Goerg Hannes)

(1)

Mishnaevsky, L. (Leon)

(1)

Mishnaevsky, Leon. author.

(1)

Nait-Abdelaziz, Moussa.

(1)

Oosterbroek, R. Edwin.

(1)

Petuya, Victor. editor.

(1)

(1)

(1)

Radjaï, Farhang.

(1)

Raghunandan, B. N. editor.

(1)

Schmauder, Siegfried. author.

(1)

Sevostianov, Igor. author.

(1)

Sih, G. C. (George C.)

(1)

Sivaramakrishna, Gullapalli. editor.

(1)

Stupkiewicz, Stanisław. author.

(1)

Tai-Ran Hsu, ed.

(1)

Tanabe, Tadaaki, 1940-

(1)

Titterton, David

(1)

Totten, George E.

(1)

(1)

Ulm, F.-J. (Franz-Josef)

(1)

Voyiadjis, George Z. author.

(1)

Voyiadjis, George Z. editor.

(1)

Vu-Khanh, Toan.

(1)

Wei, Y. G. editor.

(1)

Weng, George J. editor.

(1)

(1)

Wriggers, Peter. editor.

(1)

Wunsch, Donald C. author.

(1)

Zetterling, Carl-Mikael, ed.

(1)

Zhao, Jidong. editor.

(1)

Zheng, Q. S. editor.

(1)

(1)

Zohdi, Tarek I. editor.

(1)

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Dil

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Yayın Yılı

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(5)

(4)

(4)

(4)

(3)

(3)

(3)

(3)

(2)

(2)

(2)

(2)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

Tümünü genişlet

Konu

Micromechanics.

(16)

(9)

(8)

(7)

Surfaces (Physics).

(7)

Mechanical engineering.

(5)

Mechanics, Applied.

(4)

Computer science.

(3)

Nanotechnology.

(3)

(2)

Aerospace engineering.

(2)

(2)

Ceramic materials -- Microstructure.

(2)

Continuum Mechanics and Mechanics of Materials.

(2)

Deformations (Mechanics)

(2)

Electronic books.

(2)

Engineering design.

(2)

Metals -- Microstructure.

(2)

Micromechanics -- Mathematical models.

(2)

Microtechnology.

(2)

Aerospace Technology and Astronautics.

(1)

Analytical biochemistry.

(1)

Artificial intelligence.

(1)

Asphalt -- Mechanical properties.

(1)

Asphalt -- Microstructure.

(1)

(1)

Building materials.

(1)

Capteurs (technologie)

(1)

Ceramic materials.

(1)

Ceramics, Glass, Composites, Natural Methods.

(1)

(1)

Characterization and Evaluation of Materials.

(1)

Chemical detectors.

(1)

Classical Mechanics.

(1)

Composite materials -- Mechanical properties -- Mathematical models.

(1)

Computer vision.

(1)

Concrete construction -- Congresses.

(1)

Condensed matter.

(1)

Continuum damage mechanics.

(1)

Continuum mechanics -- Congresses.

(1)

(1)

(1)

(1)

(1)

Diodes, Schottky-barrier.

(1)

Dispositifs électromécaniques.

(1)

Electric resistance.

(1)

Electroacoustic transducers.

(1)

Electronic apparatus and appliances.

(1)

Electronic packaging.

(1)

(1)

Engine Technology.

(1)

Engineering -- Data processing -- Congresses.

(1)

Engineering -- Mathematical models -- Congresses.

(1)

Engineering Mechanics.

(1)

Engineering Thermodynamics, Heat and Mass Transfer.

(1)

(1)

(1)

(1)

Fluid mechanics.

(1)

Fluidic devices.

(1)

Fracture mechanics -- Congresses.

(1)

(1)

Geotechnical Engineering and Applied Earth Sciences.

(1)

Geotechnical engineering.

(1)

Granular materials -- Mechanical properties.

(1)

Granular materials -- Microstructure.

(1)

Grinding and polishing.

(1)

Hair Cells -- physiology.

(1)

Heat -- Transmission.

(1)

Heat engineering.

(1)

Heat exchangers -- Fluid dynamics.

(1)

Heat exchangers.

(1)

(1)

Inertial navigation.

(1)

Injection molding of ceramics.

(1)

Injection molding of metals.

(1)

Integrated circuits--Very large scale integration.

(1)

Ion implantation.

(1)

KIL HÜCRELERİ -- FİZYOLOJİ.

(1)

(1)

(1)

Materials science -- Simulation methods.

(1)

(1)

(1)

Mechanical wear.

(1)

Mechanics, applied.

(1)

Mechanische Eigenschaft.

(1)

Metaller -- Mikroyapı.

(1)

Microchemistry -- Equipment and supplies.

(1)

Microchemistry -- Equipment and supplies. Fluidic devices. Micromechanics. Analytical biochemistry.

(1)

Microelectromechanical systems -- Materials -- Textbooks.

(1)

Microelectromechanical systems.

(1)

Microelectronics.

(1)

Microfabrication.

(1)

Micromechanics -- Mathematical models -- Congresses.

(1)

Micromechanics -- Textbooks.

(1)

Micromécanique.

(1)

Microprocessors.

(1)

Microstructure -- Congresses.

(1)

Microstructure -- Mathematical models.

(1)

Microstructure.

(1)

(1)

(1)

Mikroteknoloji.

(1)

MİKROMEKANİK.

(1)

Nanostructured materials -- Mechanical properties -- Textbooks.

(1)

(1)

Numerical analysis.

(1)

Offshore Engineering.

(1)

Offshore structures.

(1)

Ohmic contacts.

(1)

Optical pattern recognition.

(1)

(1)

(1)

(1)

Polymers -- Mechanical properties.

(1)

Polymers -- Microstructure.

(1)

Porous materials -- Mechanical properties -- Mathematical models.

(1)

Porous materials -- Mechanical properties.

(1)

Power semiconductors.

(1)

SIVI MEKANİĞİ.

(1)

Sealing (Technology).

(1)

Semiconductor wafers.

(1)

Semiconductors--Junctions.

(1)

Semiconductors.

(1)

Seramik gereçler -- Mikroyapı.

(1)

Silicon compounds.

(1)

Silicon-on-insulator technology.

(1)

(1)

Soil mechanics -- Congresses.

(1)

Soil micromorphology -- Congresses.

(1)

Solid Mechanics.

(1)

(1)

Structural Materials.

(1)

Surfaces (Technology).

(1)

Telecommunication.

(1)

Temperature measuring instruments.

(1)

Thermodynamics.

(1)

(1)

(1)

Wide gap semiconductors.

(1)

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37.

Strapdown Inertial Navigation Technology için kapak resmi

Strapdown Inertial Navigation Technology

Strapdown Inertial Navigation Technology

Yazar

Titterton, David Weston, John

Yer Numarası

ONLINE

Elektronik Erişim

http://dx.doi.org/10.1049/PBRA017E

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38.

Mechanical tribology materials, characterization, and applications için kapak resmi

Mechanical tribology materials, characterization, and applications

Mechanical tribology materials, characterization, and applications

Yazar

Totten, George E. Liang, Hong.

Yer Numarası

ONLINE

Elektronik Erişim

Distributed by publisher. Purchase or institutional license may be required for access.

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39.

Lab-on-a-chip miniaturized systems for (bio)chemical analysis and synthesis için kapak resmi

Lab-on-a-chip miniaturized systems for (bio)chemical analysis and synthesis

Lab-on-a-chip miniaturized systems for (bio)chemical analysis and synthesis

Yazar

Oosterbroek, R. Edwin. Berg, A. van den (Albert)

Yer Numarası

ONLINE

Elektronik Erişim

ScienceDirect http://www.sciencedirect.com/science/book/9780444511003

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40.

Silicon Wafer Bonding Technology for VLSI and MEMS Applications için kapak resmi

Silicon Wafer Bonding Technology for VLSI and MEMS Applications

Silicon Wafer Bonding Technology for VLSI and MEMS Applications

Yazar

Iyer, S. S., ed. Auberton-Herv�, A. J., e

Yer Numarası

ONLINE

Elektronik Erişim

http://dx.doi.org/10.1049/PBEP001E

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41.

Process Technology for Silicon Carbide Devices için kapak resmi

Process Technology for Silicon Carbide Devices

Process Technology for Silicon Carbide Devices

Yazar

Zetterling, Carl-Mikael, ed.

Yer Numarası

ONLINE

Elektronik Erişim

http://dx.doi.org/10.1049/PBEP002E

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42.

Micro flows : fundamentals and simulation için kapak resmi

Micro flows : fundamentals and simulation

Micro flows : fundamentals and simulation

Yazar

Karniadakis, George. Beskok, Ali, 1966- ort. yaz.

Yer Numarası

TA 357 K36 2002

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43.

Computational materials science the simulation of materials microstructures and properties için kapak resmi

Computational materials science the simulation of materials microstructures and properties

Computational materials science the simulation of materials microstructures and properties

Yazar

Raabe, Dierk.

Yer Numarası

ONLINE

Elektronik Erişim

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John Wiley http://dx.doi.org/10.1002/3527601945
HathiTrust Digital Library Limited view (search only) http://catalog.hathitrust.org/api/volumes/oclc/40821147.html

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44.

Damage mechanics için kapak resmi

Damage mechanics

Damage mechanics

Yazar

Krajcinovic, Dusan.

Yer Numarası

ONLINE

Elektronik Erişim

ScienceDirect http://www.sciencedirect.com/science/book/9780444823496

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45.

Dynamic behavior of materials için kapak resmi

Dynamic behavior of materials

Dynamic behavior of materials

Yazar

Meyers, Marc A.

Yer Numarası

ONLINE

Elektronik Erişim

http://onlinelibrary.wiley.com/book/10.1002/9780470172278
John Wiley http://dx.doi.org/10.1002/9780470172278
HathiTrust Digital Library, Limited view (search only) http://catalog.hathitrust.org/api/volumes/oclc/28854235.html

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