Arama Sonuçlarını Sınırlandır
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SpringerLink (Online service)
(37)
Kapralos, Bill. editor.
(4)
Rousseau, Jean-Jacques. editor. (orcid)
(4)
Alfnes, Erlend. editor.
(2)
Cognard, Philippe.
(2)
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1. 
Information and Communication Technologies in Education, Research, and Industrial Applications 18th International Conference, ICTERI 2023, Ivano-Frankivsk, Ukraine, September 18-22, 2023, Proceedings için kapak resmi
Information and Communication Technologies in Education, Research, and Industrial Applications 18th International Conference, ICTERI 2023, Ivano-Frankivsk, Ukraine, September 18-22, 2023, Proceedings
Yazar 
Antoniou, Grigoris. editor. Ermolayev, Vadim. editor. Kobets, Vitaliy. editor. Liubchenko, Vira. editor. Mayr, Heinrich C. editor.
Yer Numarası 
XX(520741.1)
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-48325-7
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2. 
Advances and Trends in Artificial Intelligence. Theory and Applications 36th International Conference on Industrial, Engineering and Other Applications of Applied Intelligent Systems, IEA/AIE 2023, Shanghai, China, July 19-22, 2023, Proceedings, Part I için kapak resmi
Advances and Trends in Artificial Intelligence. Theory and Applications 36th International Conference on Industrial, Engineering and Other Applications of Applied Intelligent Systems, IEA/AIE 2023, Shanghai, China, July 19-22, 2023, Proceedings, Part I
Yazar 
Fujita, Hamido. editor. (orcid) Wang, Yinglin. editor. Xiao, Yanghua. editor. Moonis, Ali. editor. SpringerLink (Online service)
Yer Numarası 
XX(521400.1)
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-36819-6
Format: 
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3. 
Advances and Trends in Artificial Intelligence. Theory and Applications 36th International Conference on Industrial, Engineering and Other Applications of Applied Intelligent Systems, IEA/AIE 2023, Shanghai, China, July 19-22, 2023, Proceedings, Part II için kapak resmi
Advances and Trends in Artificial Intelligence. Theory and Applications 36th International Conference on Industrial, Engineering and Other Applications of Applied Intelligent Systems, IEA/AIE 2023, Shanghai, China, July 19-22, 2023, Proceedings, Part II
Yazar 
Fujita, Hamido. editor. (orcid) Wang, Yinglin. editor. Xiao, Yanghua. editor. Moonis, Ali. editor. SpringerLink (Online service)
Yer Numarası 
XX(521094.1)
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-36822-6
Format: 
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4. 
Handbook of adhesives and sealants. Volume 1, Adhesives and sealants basic concepts and high tech bonding için kapak resmi
Handbook of adhesives and sealants. Volume 1, Adhesives and sealants basic concepts and high tech bonding
Yazar 
Cognard, Philippe.
Yer Numarası 
ONLINE
Elektronik Erişim 
ScienceDirect http://www.sciencedirect.com/science/book/9780080445540
Format: 
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5. 
Handbook of adhesives and sealants için kapak resmi
Handbook of adhesives and sealants
Yazar 
Cognard, Philippe.
Yer Numarası 
ONLINE
Elektronik Erişim 
ScienceDirect http://www.sciencedirect.com/science/book/9780080447087
Format: 
Durum 
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6. 
Polyimides and other high temperature polymers synthesis, characterization and applications. için kapak resmi
Polyimides and other high temperature polymers synthesis, characterization and applications.
Yazar 
International Symposium on Polyimides and other High Temperature Polymers.
Yer Numarası 
ONLINE
Elektronik Erişim 
Distributed by publisher. Purchase or institutional license may be required for access.
Format: 
Durum 
Çevrimiçi Kütüphane~1
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7. 
Polyimides and other high temperature polymers synthesis, characterization and applications. için kapak resmi
Polyimides and other high temperature polymers synthesis, characterization and applications.
Yazar 
International Symposium on Polyimides and other High Temperature Polymers.
Yer Numarası 
ONLINE
Elektronik Erişim 
Distributed by publisher. Purchase or institutional license may be required for access.
Format: 
Durum 
Çevrimiçi Kütüphane~1
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8. 
Cellular Vehicle-to-Everything (C-V2X) için kapak resmi
Cellular Vehicle-to-Everything (C-V2X)
Yazar 
Chen, Shanzhi. author. Hu, Jinling. author. Zhao, Li. author. Zhao, Rui. author. Fang, Jiayi. author.
Yer Numarası 
XX(520181.1)
Elektronik Erişim 
https://doi.org/10.1007/978-981-19-5130-5
Format: 
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9. 
Hyperparameter Tuning for Machine and Deep Learning with R A Practical Guide için kapak resmi
Hyperparameter Tuning for Machine and Deep Learning with R A Practical Guide
Yazar 
Bartz, Eva. editor. Bartz-Beielstein, Thomas. editor. Zaefferer, Martin. editor. Mersmann, Olaf. editor. SpringerLink (Online service)
Yer Numarası 
XX(520182.1)
Elektronik Erişim 
https://doi.org/10.1007/978-981-19-5170-1
Format: 
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10. 
Frontiers of Quality Electronic Design (QED) AI, IoT and Hardware Security için kapak resmi
Frontiers of Quality Electronic Design (QED) AI, IoT and Hardware Security
Yazar 
Iranmanesh, Ali. editor. SpringerLink (Online service)
Yer Numarası 
XX(520193.1)
Elektronik Erişim 
https://doi.org/10.1007/978-3-031-16344-9
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11. 
Digital Transformation Core Technologies and Emerging Topics from a Computer Science Perspective için kapak resmi
Digital Transformation Core Technologies and Emerging Topics from a Computer Science Perspective
Yazar 
Vogel-Heuser, Birgit. editor. Wimmer, Manuel. editor. SpringerLink (Online service)
Yer Numarası 
XX(520204.1)
Elektronik Erişim 
https://doi.org/10.1007/978-3-662-65004-2
Format: 
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12. 
ICDSMLA 2021 Proceedings of the 3rd International Conference on Data Science, Machine Learning and Applications için kapak resmi
ICDSMLA 2021 Proceedings of the 3rd International Conference on Data Science, Machine Learning and Applications
Yazar 
Kumar, Amit. editor. Senatore, Sabrina. editor. Gunjan, Vinit Kumar. editor. SpringerLink (Online service)
Yer Numarası 
XX(520205.1)
Elektronik Erişim 
https://doi.org/10.1007/978-981-19-5936-3
Format: 
Durum 
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