Yazar
Dagur, Arvind. Shukla, Dhirendra Kumar.
Yer Numarası
Q335
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9781003510833
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
Chatterjee, Prasenjit, 1982- editor. Yazdani, Morteza, editor. Fernández-Navarro, Francisco (Fransisco de Asís), editor. Pérez-Rodríguez, Javier, editor.
Yer Numarası
TA347 .A78
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9781003104858
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
Gohil, Jay, author. Shah, Manan (Manan Rajiv), author.
Yer Numarası
HD9560.5
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9781003185710
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
IRTM (2021 : Kolkata, India) author. Chakrabarti, Satyajit, editor.-
Yer Numarası
Q180.55 .I48 I78 2021
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9781003202240
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
International Conference on Intelligent Systems and Smart Infrastructure (2022 : Prayagraj, India), creator. Mishra, Brijesh, editor. Wairya, Subodh, editor. Tiwari, Manish, editor. Singh, Rakesh Kumar, editor.
Yer Numarası
Q335
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9781003357346
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
Sheng, Cheng, author.
Yer Numarası
TK5105.5833
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9781003144038
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Yazar
Yu, Junzhi (Writer on robotics), author. Chen, Xingyu (Writer on robotics), author. Kong, Shihan, author.
Yer Numarası
TC1662 .Y834 2021
Elektronik Erişim
Taylor & Francis https://www.taylorfrancis.com/books/9781003144281
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format:
Durum
Çevrimiçi Kütüphane~1
Kopya:
Eylem Seç


![ARTIFICIAL INTELLIGENCE AND INFORMATION TECHNOLOGIES. Volume 2 Proceedings of the International Conference on Artificial Intelligence and Information Technologies , 3-4 November 2023, Samarkand, Uzbekistan / edited by Arvind Dagur and Dhirendra Kumar Shukla [and 3 others]. için kapak resmi ARTIFICIAL INTELLIGENCE AND INFORMATION TECHNOLOGIES. Volume 2 Proceedings of the International Conference on Artificial Intelligence and Information Technologies , 3-4 November 2023, Samarkand, Uzbekistan / edited by Arvind Dagur and Dhirendra Kumar Shukla [and 3 others]. için kapak resmi](/client/assets/5.0.0.9/ctx//client/images/no_image.png)