Title:
Introduction to microsystem packaging technology
Author:
Jin, Yufeng., author.
ISBN:
9781315217086
9781351824286
9781439865972
Physical Description:
1 online resource (xiii, 218 pages)
General Note:
A CRC title.
Contents:
ch. 1. Introduction -- ch. 2. Design technique for microsystems packaging and integration -- ch. 3. Substrate technology -- ch. 4. Interconnection technology -- ch. 5. Device-level packaging -- ch. 6. MEMS packaging -- ch. 7. Module assembly and optoelectronic packaging -- ch. 8. System-level packaging technology -- ch. 9. Reliability -- ch. 10. Prospects for microsystems packaging technology.
Subject Term:
Electronic Access:
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Library | Material Type | Item Barcode | Shelf Number | Status | Item Holds |
|---|---|---|---|---|---|
Searching... | E-Book | 546454-1001 | TK7870.15 .J56 2011 | Searching... | Searching... |