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1. 
Cover image for Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Author 
Liu, Yong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1053-9
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2. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
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3. 
Cover image for Cognitive Systems and Information Processing 7th International Conference, ICCSIP 2022, Fuzhou, China, December 17-18, 2022, Revised Selected Papers
Cognitive Systems and Information Processing 7th International Conference, ICCSIP 2022, Fuzhou, China, December 17-18, 2022, Revised Selected Papers
Author 
Sun, Fuchun. editor. Cangelosi, Angelo. editor. Zhang, Jianwei. editor. Yu, Yuanlong. editor. Liu, Huaping. editor.
Preferred Shelf Number 
XX(520758.1)
Electronic Access 
https://doi.org/10.1007/978-981-99-0617-8
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4. 
Cover image for Industrial Engineering, Management Science and Applications 2015
Industrial Engineering, Management Science and Applications 2015
Author 
Gen, Mitsuo. editor. Kim, Kuinam J. editor. Huang, Xiaoxia. editor. Hiroshi, Yabe. editor. SpringerLink (Online service)
Preferred Shelf Number 
XX(518706.1)
Electronic Access 
https://doi.org/10.1007/978-3-662-47200-2
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