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1. 
Cover image for Bottles, preforms and closures [a design guide for PET packaging
Bottles, preforms and closures [a design guide for PET packaging
Author 
Brandau, Ottmar.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9781437735260
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2. 
Cover image for Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Author 
Liu, Yong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1053-9
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3. 
Cover image for Packaging design : successful product branding from concept to shelf
Packaging design : successful product branding from concept to shelf
Author 
Klimchuk, Marianne Rosner. Krasovec, Sandra A.
Preferred Shelf Number 
TS195.4 K65 2012
Format: 
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4. 
Cover image for Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author 
Li, Er-Ping.
Preferred Shelf Number 
TK7874.893 L53 2012
Format: 
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5. 
Cover image for Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author 
Li, Er-Ping. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEEXplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551
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6. 
Cover image for Really good packaging explained top design professionals critique 300 package designs & explain what makes them work
Really good packaging explained top design professionals critique 300 package designs & explain what makes them work
Author 
Edwards, Bronwen.
Preferred Shelf Number 
ONLINE
Electronic Access 
EBSCOhost http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=571401
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7. 
Cover image for LED packaging for lighting applications design, manufacturing, and testing
LED packaging for lighting applications design, manufacturing, and testing
Author 
Liu, S. (Sheng), 1963- Luo, Xiaobing, 1974-
Preferred Shelf Number 
ONLINE
Electronic Access 
Click here to view book
John Wiley http://dx.doi.org/10.1002/9780470827857
http://site.ebrary.com/lib/alltitles/Doc?id=10490643
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8. 
Cover image for Packaging research in food product design and development
Packaging research in food product design and development
Author 
Moskowitz, Howard R. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
Wiley InterScience An electronic book accessible through the World Wide Web; click for information
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9. 
Cover image for Practical guide to the packaging of electronics thermal and mechanical design and analysis
Practical guide to the packaging of electronics thermal and mechanical design and analysis
Author 
Jamnia, Ali, 1961-
Preferred Shelf Number 
ONLINE
Electronic Access 
Distributed by publisher. Purchase or institutional license may be required for access.
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10. 
Cover image for Package design workbook : the art and science of successful packaging
Package design workbook : the art and science of successful packaging
Author 
DuPuis, Steven. Silva, John.
Preferred Shelf Number 
NC1002.P33 D87 2008
Format: 
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11. 
Cover image for Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Author 
Suhir, Ephraim. Lee, Y. C. Wong, C. P.
Preferred Shelf Number 
TK7874 .M438 2007 V.1
Format: 
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12. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
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