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1. 
Cover image for Lifetime Reliability-aware Design of Integrated Circuits
Lifetime Reliability-aware Design of Integrated Circuits
Author 
Raji, Mohsen. author. Ghavami, Behnam. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-15345-7
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2. 
Cover image for Emerging Electronic Devices, Circuits and Systems Select Proceedings of EEDCS Workshop Held in Conjunction with ISDCS 2022
Emerging Electronic Devices, Circuits and Systems Select Proceedings of EEDCS Workshop Held in Conjunction with ISDCS 2022
Author 
Giri, Chandan. editor. Iizuka, Takahiro. editor. Rahaman, Hafizur. editor. Bhattacharya, Bhargab B. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-99-0055-8
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3. 
Cover image for Terrestrial radiation effects in ULSI devices and electronic systems
Terrestrial radiation effects in ULSI devices and electronic systems
Author 
Ibe, Eishi H., author.
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ONLINE(342252.1)
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9781118479308
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4. 
Cover image for Micro-Relay Technology for Energy-Efficient Integrated Circuits
Micro-Relay Technology for Energy-Efficient Integrated Circuits
Author 
Kam, Hei. author. Chen, Fred. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-2128-7
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5. 
Cover image for Computational Intelligence in Analog and Mixed-Signal (AMS) and Radio-Frequency (RF) Circuit Design
Computational Intelligence in Analog and Mixed-Signal (AMS) and Radio-Frequency (RF) Circuit Design
Author 
Fakhfakh, Mourad. editor. Tlelo-Cuautle, Esteban. editor. Siarry, Patrick. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-19872-9
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6. 
Cover image for Green electronics manufacturing creating environmental sensible products
Green electronics manufacturing creating environmental sensible products
Author 
Wang, John X., 1962-
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Distributed by publisher. Purchase or institutional license may be required for access.
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7. 
Cover image for Semiconductor process reliability in practice
Semiconductor process reliability in practice
Author 
Gan, Zhenghao. Wong, Waisum. Liou, Juin J.
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8. 
Cover image for ESD failure mechanisms and models
ESD failure mechanisms and models
Author 
Voldman, Steven H. Wiley InterScience (Online service)
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John Wiley http://dx.doi.org/10.1002/9780470747254
http://site.ebrary.com/lib/alltitles/Doc?id=10317806
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9. 
Cover image for Low-power HF Microelectronics A unified approach
Low-power HF Microelectronics A unified approach
Author 
Machado, Gerson A. S., ed.
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http://dx.doi.org/10.1049/PBCS008E
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10. 
Cover image for Electronics reliability and measurement technology nondestructive evaluation
Electronics reliability and measurement technology nondestructive evaluation
Author 
Heyman, Joseph S.
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ScienceDirect http://www.sciencedirect.com/science/book/9780815511717
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