Cover image for Reflow soldering processes SMT, BGA, CSP and flip chip technologies
Title:
Reflow soldering processes SMT, BGA, CSP and flip chip technologies
Author:
Lee, Ning-Cheng.
ISBN:
9780080492247
Publication Information:
Boston : Newnes, c2002.
Physical Description:
1 online resource (ix, 270 p.) : ill.
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