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Cover image for Through-silicon vias for 3D integration
Through-silicon vias for 3D integration
Author 
Lau, John.
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ONLINE
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2. 
Cover image for Handbook of wafer bonding
Handbook of wafer bonding
Author 
Ramm, Peter. Lu, James Jian-Qiang. Taklo, Maaike M. V.
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527644223
Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=822735
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