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1. 
Cover image for Through-silicon vias for 3D integration
Through-silicon vias for 3D integration
Author 
Lau, John.
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2. 
Cover image for Handbook of 3D integration technology and applications of 3D integrated circuits
Handbook of 3D integration technology and applications of 3D integrated circuits
Author 
Garrou, Philip E. Bower, Christopher Andrew. Ramm, Peter. Wiley InterScience (Online service)
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John Wiley http://dx.doi.org/10.1002/9783527623051
ebrary http://site.ebrary.com/id/10577606
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3. 
Cover image for Interlayer dielectrics for semiconductor technologies
Interlayer dielectrics for semiconductor technologies
Author 
Murarka, S. P. Eizenberg, M. (Moshe) Sinha, A. K. (Ashok K.)
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ScienceDirect http://www.sciencedirect.com/science/book/9780125112215
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4. 
Cover image for Silicon Wafer Bonding Technology for VLSI and MEMS Applications
Silicon Wafer Bonding Technology for VLSI and MEMS Applications
Author 
Iyer, S. S., ed. Auberton-Herv�, A. J., e
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http://dx.doi.org/10.1049/PBEP001E
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